Upcoming Conference

2004 IEEE 54th Electronic Components & Technology Conference June 1-4, 2004; Las Vegas NV jadams@eia.org Judy Adams 1-703-907-7536 (fax:1-703-907-7549)**Photomask Europa 2004 ; June 21-24, 2004; Dresden, Germany

Photomask Europa 2004 June 21-24, 2004; Dresden, Germany

7th IEEE International Academic Conference on Next Generation Microsystem Packaging Research and Education, June 28-30, 2004; Shanghai, China ; Ms Chen Jie, smit@mail.shu.edu.cn

6th IEEE Conference on High Density Microsystem Design and Packaging and Failure Analysis (HDP'04); June 30-July 3, 2004; Shanghai, China ; Ms Chen Jie, smit@mail.shu.edu.cn

SEMI Technology Symposium: 29th International Electronics Manufacturing Technology (IEMT) July 14-16, 2004; San Jose CA Gloria Lou, SEMI glou@semi.org 1-408-943-7048

2004 IEEE Holm Conference on Electrical Contacts September 20-23, 2004; Seattle WA Jennifer Lambert (IEEE Confer Mgmt) j.lambert@ieee.org 1-732-981-3870 fax: 1-732-981-1203

7th VLSI Packaging Workshop of Japan (VLSI Pkgng) ; Nov 30 - Dec 2, 2004; Kyoto, Japan ; Dr. Max Kohno, Dow Chemical. +81-550-82-8030 mkohno@dow.com

6th International Conference on Electronic Materials & Packaging (EMAP); December 5-7, 2004; Penang, Malaysia; Prof. K N Setharamu, USM, knseetharamu@hotmail.com

6th Electronics Packaging Technology Conference (EPTC'04); December 8-10, 2004; Singapore; Prof. Toh Kok Chuan, Nanyang Technological Univ, +65 6790 5583. mkctoh@ntu.edu.sg