CHAPTER NEWS

REGION 10 CHAPTER ACTIVITY ROUND-UP. -- by Dr. P. B. Parikh

· Dr. Cheung Yiu-Ming, Ken Chairman of CPMT Hong Kong chapter has reported that the technical workshop (reported in our earlier issue) by Dr. Michael Pecht on "Monitoring the Health (Reliability) of Products" held on 9th June was very successful. The CPMT Hong Kong chapter has subsequently arranged four more technical events during the quarter as under:-

Ø "Trends in High Density Packaging and Portable Microelectronics" by
E. Jan Vardaman (Dr. Ming Li, Vice Chair of Hong Kong Chapter is introducing speaker in picture) on June 29, 2004.
Ø "Migration to Lead-Free Microelectronics Assembly and Some Key
Technical Issues" by Dr. Karl Puttlitz on July 23, 2004.
Ø "Conductive Adhesive Joining Technology for Electronic Packaging
Applications" by Prof Johan Liu on July 26, 2004.
Ø "Preparation and Implementation of Lead-Free Soldiering", by Dr. Ning-
Cheng Lee on August 20, 2004.

The chapter also plans one more workshop on "Trend and Design of MEMS and Advanced Packaging" by Dr. K. N. Chiang in September 2004.

Dr. Cheung also informed that he would step down from the Chairmanship in December 2004 and Dr. Ming Li would be the chapter chairperson for the next two-year term 2005 and 2006. The chapter would schedule their AGM in December for the elections of Chapter Vice Chair and Chair elect.

· As reported earlier CPMT Taipei chapter had arranged a technical lecture on "Thermal-Fatigue Life Prediction of Electronic and Optoelectronic Lead-Free Interconnects" by Dr. John Lau (Dr. Shen Li Fu, Taipei Chapter chair welcomes John) on June 13, 2004 at Kaohsiung, Taiwan. In addition to this Dr. John Lau gave another talk at Industrial Technology Research Institute, Hsinchu, Taiwan on June 14, 2004.

Dr. Lih-Shan Chen Secretary of CPMT Taipei chapter has further reported a technical workshop by Dr. Ning-Cheng Lee, Vice President of Technology of Indium Corporation of America on "Preparation and Implementation for Lead-Free Soldering" on August 16, 2004. This workshop was designed to help manufacturers to prepare for and successfully implement lead-free soldering procedures. Considerations on choice of solder alloys and surface finishes, selection of equipment, design of soldering processes, inspection, rework, and supply chain preparation were presented in detail at the workshop.

· We welcome the establishment of the new Shanghai Chapter during this quarter (as reported by Dr. Zhimin Mo). A range of activities are being organized by Dr. Sam Zhang for the chapter.

· During this quarter the India Council CPMT chapter had co-organized a technical talk by Mr. Rajinder Kumar on "Creating Awareness on Lead Free Interconnect Technology" on 20th August at Hotel Sun-n-Sand with SMTA IC in Bombay.

The chapter had earlier planned to organize 2 technical lectures and one administration (Execom) meeting during the months of July and August. The Execom however had to cancel these commitments in view of lack of funds (Annual chapter rebates of 2002 as well as 2003 not yet received in spite of many requests and reminders).

Our chapter Secretary, Prof M M Shah is now back in India and would now be taking interest in our chapter activities.