System Packaging Workshop
January 31 -- February 2, 2005
The 9th European Workshop of the IEEE CPMT and Computer Societies' Systems Packaging Committee (TC-SP) will be held this year in Berlin, Germany on January 31 -- February 2, 2005 at the Park Inn Hotel, Berlin-Alexanderplatz
- General Chair: Rolf Aschenbrenner (IZM Germany)
General Co-Chair: Christine Kallmayer (IZM Germany)
Program Chair: Thomas-Michael Winkel (IBM Germany)
Technical Program Committee: Cian O Mathuna (NMRC)
- Evan Davidson (IBM US-Ret.)
Erich Klink (IBM Germany)
The IEEE Computer Society's and the IEEE CPMT's Technical Committee on System Packaging will be holding its Year 2005 European Packaging Workshop in Berlin, Germany next January. This will be the 53rd Workshop conducted by the Technical Committee on System Packaging. These workshops began as the Computer Packaging Workshop held at Split Rock Lodge in the Poconos Mountain Region of Pennsylvania, U.S.A. in 1968. Founded by Jack Balde and others from Bell Labs and IBM, they were the first IEEE meetings solely devoted to the design of and the technologies used in electronic packaging.
Initially, these workshops focused on in-depth discussions of component choices, design trade-offs for system-level optimization, system-level performance and the underlying electrical, mechanical and cooling technologies for computers and telecommunications equipment. Over the years the emphasis has changed to include more recent system development activities in Personal Computing, Workstations, Servers, Telecommunications, Wireless, Portable, Automotive, Military, Aerospace, Medical, etc. Because of today's plethora of packaging meetings mainly covering the component and technology spectrums, the Systems Packaging Technical Committee now focuses on the trade-offs required for good system design. Typical topics include component choices, functional partitioning, signal I/O requirements, electrical design, cooling techniques, technology processes, reliability, cost and overall system performance.
The goal of our workshops is to maximize the exchange of system-level packaging concepts and experiences for new and future products. We do not have concurrent sessions. This enables each attendee to participate in all the workshop's activities. Normally this facilitates enlightening and stimulating discussions for the benefit of the attendees and their affiliated organizations. Attendance varies between fifty and one hundred people.
In accordance with IEEE Workshop rules, no proceedings are published and cameras and tape recorders are strictly prohibited to encourage a spirited interchange of new information. In addition, attendance by the trade press is not normal and there are no commercial sponsorships or a "trade show" display floor. The only meeting record is a CPMT Newsletter summary provided by someone on the organizing committee.
The committee invites you to attend the next European Workshop in Berlin. We also encourage you to ask others to attend from your organization or from other companies or universities. It is only through your efforts that we can reach out to new people to keep the Systems Packaging Technical Committee and its workshops vital. Overall you will find the Systems Packaging Workshops to be a career enriching "big picture" worldwide view of electronic products. We think you'll enjoy attending.
The Preliminary Program is given below. As more information becomes available, program updates can be obtained from our web site at:
Monday: January 31, 2005
Registration in the hotel lobby: 8:00 AM to 12:00 Noon
Lunch at 12:00 Noon
Start of Afternoon Session is 1:00
"The History of Electronic Packaging"
Evan Davidson (IBM US-Ret.)
Session 1: Ambient Intelligence
Subtopics: Smart Card, RF/ID (Radio Frequency Identification),Wireless Technology, Micro-power
Session Chairs: Cian Mathuna (NMRC), Christine Kallmeyer (IZM)
Dr. Werner Weber
Session 2: Biotechnology & Biomedical Technologies
Subtopics: Medical implements, Bio-sensors, Bio-chips, Point-of-Care Diagnostics Session
Chairs: Dr. Meyer (Dräger)?, Melcholm Wilkinson
Tuesday: February 1, 2005
Session 3: Photonics & Interconnect Technology
Subtopics: Optical Devices, and Waveguides Embedded in Circuit Boards
Session Chairs: Prof. Elmar Griese, Dr. Padraig Hughes (NMRC)
(An optional tour is being planned for the afternoon.)
Session 4: High Performance Computing
Subtopics: Electrical Verification, Telecommunications, Power & Cooling
Session Chairs: George Katopis (IBM US), Paul Callender (Nokia)
"Current View of Package Technology Opportunities in the 45 nm Silicon Generation"
Bob Guernsey (IBM US)
Wednesday: February 2, 2005
Session 5: MNT (Micro & Nano Technology) Heterogeneous System Integration
Subtopics: Low-Temperature-Cofired-Ceramics, MCMs, Wafer Scale Integration,
System-on-a-Chip, MEMS Packaging, RF-MEMS, System-in-a-Package
Session Chairs: Christian Val, Rolf Aschenbrenner
"New Advances in System-in-a-Package"
Prof. Rao Tummala (Georgia Tech US)
Prof. Herbert Reichl
(Meeting will end after lunch at 1:00 PM)