IEEE/CPMT Society 10th International
Advanced Packaging Materials : Processes, Properties and Interfaces
March 16-18, 2005
Beckman Center of the National
Academies Irvine, CA, USA
Preregistration Discount through March 7th!
Wednesday - Dr. King-Ning
Tu, Department of Materials Science & Engineering,UCLA
Electromigration in flip chip solder joints
Thursday - Dr. Ho-Ming Tong, Corporate VP and GM R&D, ASE Group
Flip Chip Trends & Material Challenges
Friday - Dr. Albert Yee, Director, California Institute for Telecommunication and Information Technology, UCI
Nanofabrication of Polymeric 3-D Structures with Imprinting Techniques
Wednesday Panel on "Material Science Issues in the Implementation of Lead Free Solder IC Package & Assembly": led by Bill Chen (ASE), Jim Wilcox (IBM), Tom Gregorich (Qualcomm), Yifan Guo (Skyworks)
Technical Sessions on:
#3D and advanced packages #Solder Composition #Solder Reliability - Electromigration #Solder Manufacture and Reliability Issues #Packaging Materials #Encapsulants and Underfill #Adhesives #Anisotropic Conductive Adhesives #Dielectric and Embedded Passives #Nanocomposites
We have over 50 presentations with authors from institutions across the globe such as Intel, Flextronics, Ibiden - Japan, Advanced Semiconductor Engineering, Inc., Taiwan National Central University- Taiwan, JPL, Kyocera Wireless Corp., IME Singapore, Tampere University of Technology, UCLA, Nanyang Technological University-Singapore, Georgia Tech, UCI, Lawrence Berkeley Labs, Henkel Technologies, National Chiao Tung University- Taiwan, IJ Research, Inc., Kingston Technology Company, KAIST, Imbera Electronics- Finland, Samsung, Michigan State University, EMC Corporation, UC Berkeley, and Applied Microstructures.
On-line Registration is open now. Download the Advance Program. See the website.