CPMT Seminar at ECTC
Advanced Flexible Circuit Board Technologies
Thursday, June 2, 2005 - 7:30 PM - 10:00 PM

Chair: Yoshitaka Fukuoka - Weisti
Co-Chair: Kishio Yokouchi - Fujitsu Laboratories Ltd.

A dramatic improvement in performance has been achieved in recent mobile electronic products, such as cellular phones, digital camcorders, digital still cameras, personal digital assistant, note PC and so on. Additional improvement would require a higher density and layer count flexible printed circuit board and rigid/flex circuits board technologies. Especially in Japan, those technologies are developing remarkably. This session focuses on the latest technical information of advanced flexible, rigid/flexible circuit board technologies, advanced processes and advanced materials, and their characteristics estimation results.

1. Technical Trends of Advanced Two-Layer Flexible Copper Clad Laminate
Masahiko Takeuchi - Nippon Steel Chemical

2. Ultra Thin Flexible Circuit Board Used Photo-Sensitive Polyimide and Semi-Additive Process
Yasuhito Oowaki - Nitto Denko Corporation

3. Advanced Rigid-Flexible Circuit Board Technologies
Yoshihisa Katoh - CMK Corporation

4. All Layer IVH Substrate Made From the Polyimide Film
Masaaki Katsumata, Hitoshi Nakamura and Fumio Echigo - Matsushita Electronic Components Co., Ltd.

5. Electrical Characterization of Thin-Film Embedded Passives
Koichiro Nakase, Daisuke Ohshima, and Hirobumi Inoue - NEC Corporation

This session is open to all conference and exhibit attendees.