The CPMT Society has been graced over the years with many dedicated volunteers from all corners of the globe. To recognize the efforts of these individuals, the Society recently presented "Presidents Awards" to thank several of these volunteers who have contributed their time and energy to advance the Microelectronics Industry and our Society's mission.
During the 7th VLSI Packaging Workshop, held in Japan last December, Rolf Aschenbrenner, Technical Vice President of the CPMT Society presented George Harman, NIST and IEEE Fellow, a certificate of recognition for "… a lifetime of contributions to the electronics industry and the CPMT Society". George (SM'75-F'82), who worked his entire career at NIST(NBS), received the B.S. degree in l physics from the VPI and his M.S. in physics from University of Maryland. He has published over 60 papers, two books on wire bonding, eight book chapters, and has four patents. George has received many awards from the IEEE, IMAPS, DVS, SME, and NIST. He is a Fellow Emeritus of the National Institute of Standards and Technology, and has been a Research Fellow at the University of Reading, UK. He chaired the IEEE CPMT Fellows committee for 15 years. He is on the ITRS Roadmap Committee for Assembly and Packaging. Currently he serves as a National and International consultant in the field of wire bonding and electronic packaging.
Rolf also presented Kanji Otsuka , Meisei University with a lifetime contribution commendation to recognize "… his many contributions to CPMT Society activities in the Far East region, especially the founding of the VLSI packaging workshop". Professor Otsuka, (F'98) received his PhD in Materials Science from Tokyo Institute of Technology. He worked for Hitachi Ltd. From 1959 to 1992 in semiconductor group and then the computer group, in charge of materials and package design and development for semiconductors and computers. Since 1992, he has been a professor of Electronics and Computer Science at Meisei University.. He has been the Dean of Faculty of Informatics from 2001 to now. He has been involved with many IEEE/CPMT activities, especially the VLSI Packaging Workshop in Japan of which he was the founder.
Finally, in January, CPMT Society President, Phil Garrou, presented Herbert Reichl
of Fraunhofer IZM (Germany), 2003 IEEE Fellow, with recognition
of his lifetime of technical achievement in microelectronics as
"…a scholar, mentor and global leader" . . Prof.
H. Reichl studied Electrical Engineering at the Technical University
Munich and received his Doctor Degrees in 1974. He was a scientific
assistant at Fraunhofer Institute IFT and became head of the department
"Semiconductor Technologies" and later head of the department
"Sensor and Application Techniques". In 1981 he became
a professor at the Technical College Munich.
Since 1987 he is professor for Packaging and Interconnection Technologies
at the Technical University Berlin and head of the Research Center
Microperipherics. Since 1993 he is also head of the Fraunhofer
IZM Berlin. In 1996 he further became Head of the Board of Directors
of the Fraunhofer Group Microelectronics.
Prof. Reichl has written and co-authored 6 books and more than
500 articles. Prof. Reichl holds more than 50 patents, mainly
in the field of packaging and interconnection technologies. He
is also editor or scientific supervisor of several technical journals.
In 2000 he was honored with the "Bundesverdienstkreuz"
of the Federal Republic of Germany.
Congratulations to these 3 honorees who have made great advances
in our field and have served CPMT well.