FOR IMMEDIATE RELEASE                                                Contact: Jim Bruorton       (864) 963-6621

        (Orlando, Florida USA - March 7, 2005)--The program for the 55th Electronic Components & Technology Conference at the Wyndham Palace Resort & Spa will feature more than 320 technical papers presented by leaders in their field representing countries from around the world.
        The conference is organized into 36 oral presentation sessions, 2 poster sessions and, for the first time, two student poster sessions. The technical sessions focus on leading-edge developments and technical innovations in several areas: high performance package design, simulation and manufacturing, advanced packaging technologies including nano- and bio-packaging, interconnections, optoelectronics, and reliability. The 40 technical sessions are organized by technical subcommittees consisting of more than 150 volunteer engineers and scientists who review and rate all the submitted abstracts.
        ECTC is again co-sponsoring with iNEMI the Tin Whisker Workshop on May 31st beginning at 8:30AM. A one day registration for the ECTC conference will be required to attend the workshop.
        The 55th ECTC will feature a Tuesday evening, May 31 Panel Discussion on “Lead-Free Industry Update”, and a Wednesday evening, June 1 Plenary Session focusing on “Global Manufacturing Opportunities and Challenges.”
        New this year to ECTC is the CPMT Seminar being held on June 2nd at 7:30PM. This seminar will address “Advanced Flexible Circuit Board Technologies”.
        An all-day educational seminar will be offered on Tuesday, May 31, 2005 consisting of 16 Professional Development Courses. Mr. Rao Bonda and the Professional Development Course committee have brought together industry experts from a wide variety of disciplines to offer state-of-the-art technology reviews and updates in condensed half-day and full-day formats. Course topics cover a wide range of technologies, including Nanoscale Packaging and Systems, Trends in Advanced Packaging,Moisture Related Reliability in Electronic Packaging, Lead-Free Soldering and Recent Advances in Polymers for Electronic Packaging. These courses are eligible for Continuing Education Unit (CEU) credits.
        The Technology Corner on Wednesday afternoon, June 1 and Thursday, all-day June 2 will feature exhibits of the newest products and services available in an environment that enables discussion and interaction with the managers, engineers, and scientists attending ECTC.
        ECTC attendees can receive Conference Proceedings as a CD-ROM or a printed version. Both the CD-ROM copy and printed may be purchased for an additional $50 charge.
        We encourage any editorial coverage you can give the conference and will provide complimentary registration and proceedings for your editorial representative planning to attend.
               
The 55th ECTC Advance Program is available from:
        Jim Bruorton, ECTC Publicity Chairman
        2005 Electronic Components & Technology Conference
        c/o KEMET Electronics Corporation
        P.O. Box 5928
        Greenville, SC 29606
        Telephone: (864) 963-6621
        Fax: (864) 963-6444
        Email: margieballinger@kemet.com

or you may visit the ECTC website at www.ectc.net and download the information and program from that location.

The 55th ECTC conference is sponsored by the Electronic Components, Assemblies, and Materials Association of the EIA (ECA) and the IEEE Components, Packaging and Manufacturing Technology Society.