PRINTED CIRCUIT BOARD INNOVATOR RECEIVES IEEE AWARD
The IEEE has named Yutaka Tsukada, managing director of the Advanced Packaging
Laboratory at Kyocera SLC Technologies Corporation in Shiga-Kan, Japan, and formerly with
IBM Japan, as recipient of the 2005 IEEE Components, Packaging and Manufacturing
Technology Award. The award honors Tsukada for pioneering contributions in micro-via
technology for printed circuit boards and for extending the feasibility of the direct flip-chip
In the PCB industry, he is regarded as an innovator in the area of high-performance,
economical, compact and lightweight PCB packaging. Technologies developed by Mr. Tsukada
are used in most PCB applications, including cellular telephones, portable and desktop PC
processors, digital signal processors, digital cameras and workstation components.
He pioneered the development of build-up PCB micro-vias and developed a solution for
underfill, reinforced flip-chip bonding. The build-up PCB radically changed the structure of
PCBs, allowing a single, build-up layer with micro-vias and fine-line wiring to replace, at a lower
cost, as many as four layers of conventional PCB wiring. These advances allow wiring and
chips to be attached directly by flip-flop bonding, yet still accommodate the wiring required for
signal-line fan-out and power connections.
Leading companies such as IBM, Intel, AMD, Motorola and Texas Instruments, have
adopted Mr. Tsukadas innovations in their core package design to gain denser and faster IC
chips. He holds three Japanese and three U.S. patents for PCB packaging technology.
Sponsored by the IEEE Components, Packaging and Manufacturing Technology
Society, the award recognizes meritorious contributions to the advancement of components,
electronic packaging or manufacturing technologies. It will be presented at the 2005 IEEE 55th
Electronic Components and Technology Conference in June in Lake Buena Vista, Fla.