ICEPT - CALL FOR PAPERS (also ISEPT)

6th International Conference on Electronics Packaging Technology
Shenzhen Convention & Exhibition Center - Shenzhen, China
August 30 - Sept. 2, 2005

For further info, please visit:
http://www.prc.gatech.edu/events/icept05/index.htm

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ABSTRACTS DUE May 25, 2005
Please send your title with abstract (500 words)
via email to wangcq@hit.edu.cn, including your affiliation, email address,
zip code, mailing address, and phone number.
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ABOUT ICEPT
Since 1994, ICEPT electronic packaging conferences have been held in
China every two years. Over 400 attendees have presented and exchanged
information at ICEPT which attracts researchers, developers and
producers of packaging technology for ICs, MEMs, Opto, LEDs, LCDs,
sensors, package substrates, PCBs and assembly.

SESSION TOPICS
- System Packaging & Integration
- Electrical & Mechanical Design, Modeling & Tools
- Materials & Processes
- High Density Substrate & PCB
- Microjoining & Assembly
- Surface Mount Technology
- Flip Chip & Wafer Level Packaging
- MEMS, LED, LCD & Optoelectronics Packaging
- Manufacturing
- Reliability
- Poster Session