Region 10 Chapter Activity Round up

Dr. Pey Kin Leong, Chapter Chair of Singapore IEEE REL/CPMT/ED Chapter has reported activities during this quarter as under:-

(a) Technical Talks

(i) "Nanoscale Elastic Circuits" by Prof. Arokia Nathan of the University of Waterloo, Canada, on March 14, 2005.

(ii) "Novel Nano- crystals and SONOS-type Nano-dots Flash" by Mr. Chen Jinghao of the National University of Singapore on March 28, 2005.

(b) The Chapter has donated a sum of S$800 to the Student Chapter of the Nanyang Technological University branch for organizing the IEEE Science Symposium (2005) and IEEE - Student Professional Awareness Conference.

(c) The CPMT Singapore Chapter is preparing for the 7th Electronics Packaging Technology conference (EPTC - 2005) on 7th - 9th December, 2005, with Mr. Y.C. Mui of advanced Micro Devices as General Chair and Mr. James How from Motorola and Mr. John HL Pang from Nanyang Technological University as technical chairs. The call for papers has been initiated to 6000 fellow Researchers, Managers etc.

(d) The Chapter is organizing the 12th IPFA event being held from June 27 to July1, 2005 (5 days). About 70 papers with six tutorials would be presented at the symposium. The exhibition has already received bookings for 26 booths.

(e) The Chapter has also reported organization of 8th WIMNACT being held on July 2, 2005 at Singapore. Four Overseas Distinguished Lecturers and other local distinguished lecturers have agreed to make presentations at the workshop on the latest developments on Nanoscale CMOS Technology.

Malaysia Chapter had their AGM on Mar 19-2005, and have elected Dr. CH Chew (from ON Semiconductor) as chapter chair. Professor Seetharamu will continue as past Chapter Chair Advisor. The Chapter would like to express its gratitude to Prof Seetharamu for his distinguished service.

During January-June 2005, the chapter has two organized talks (from the industry experts in the area of semiconductor packaging) as under:-

(i) "Understanding Of Leadframe Manufacturing" and

(ii) "Fundamental Knowledge of Bonding Wire".

An industrial visit was also organized for students from the University of Nottingham (Malaysia Campus) to a semiconductor packaging house.

The India Council Chapter is busy organizing their annual seminar co-sponsored with SMTA-India Chapter. This 5-day event will be organized from July 16, 2005 - July 20, 2005, at New Delhi and would also include a Surface Mount Technology Certification course conducted by overseas experts. On behalf of India Council CPMT Chapter Dr. Parikh will be actively associated with the organization of this event.

-- submitted by Dr. P. B. Parikh