News Item for TC- 5 Technical Meeting on Materials & Processes

The committee meeting was held on June 1, 2005, in conjunction with 55th ECTC at Lake Buena Vista, FL. Ten Packaging Material enthusiastics from around the world attended the meeting. The main topic of discussion was the future of Advanced Packaging Materials Conference. This conference will be held in Atlanta in 2006, in Silicon Valley in 2007. The potential venue for 2008 is Dallas, and the potential venue for 2009 is again in California.

-- submitted by Rajen Chanchani, chair TC-5
All We had a good TC meeting in Orlando. The following attended: Kwang-Lung Lin Chen Kung University, taiwan Richard Benson John Hopkins APL Bill Brown U of Arkansas Ephrahim Suhir UC, santa Cruz C.C. Lee UC, Irvine Charles Lee Infineon, Singapore V. Kripesh IME, Singapore John Pang Nanyang Tech. University, Singapore The main topic of discussion was the future of Advanced Packaging Materials Conference. This conference will be held in Atlanta in 2006, in Silicon Valley in 2007. The potential venue for 2008 is Dallas, and the potential venue for 2009 is again in California. I am attaching the VGs that I presented at the meeting. Best Regards Rajen