ECTC Technical Session were a Great Success

Approximately 900 engineers listened to 325 presenters at the 55th ECTC in Orlando Florida in the first week of June.

Picture 1: Speakers' reception

Picture 2: Speakers' breakfast

Picture 3: Session 6 -- Optical Packaging and Assembly -- Chairs Randy Heyler and Ping Zhou

Picture 4:Session 12 --RF Modules and Systems -- Chair Craig Gaw with speaker Matti Mantysalo of Tampere University of Technology

Picture 5: Poster session swarmed with questioners

Picture 6: Poster session coffee break gave James Morris, Lohan Liu, and Al Puttlitz a chance to compare notes

Picture 7: Fifty Exhibition booths presented many technologies

Picture 8: Li Li, Craig Gaw, and Lih-Tyng Hwang try to capture announcements on session 12 computer

Picture 9: Session 18 -- Integrated Passives -- Chair Li Li introduces George Kopoulos of SV Mivrowave

Picture 10: Session 19 -- 3D / SIP / SOP Packaging -- Chairs Luu Nguyen and E. Jan Vardaman

Picture 11: Emily Crespin explains her poster presentation to passing throng

Picture 12: Session 23 -- Thermal / Mechanical Simulation -- Chairs Pradeep Lall and Tony Mak lead session

Picture 13: Donna Noctor and Eric Perfecto form the day's strategy at speakers' breakfast meeting

Picture 14: Session 25 -- MEMS Packaging -- Chair Daniel Baldwin introduces speaker Edward Chan

Picture 15: Student Poster Session -- Steffen Uhlig of Linkoping University

Picture 16: Session 31 -- Advanced Substrates / Modules Packaging -- Chairs Altaf Hasan and Gary Morrison

Picture 17: Session 31 -- speaker Glenn Robertson