"Fundamentals of Microsystems Packaging"
The First Fundamental and Introductory Textbook in Microsystems Packaging

by Rao R. Tummala
Published by McGraw-Hill, New York, NY U.S.A.

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THE VISION FOR THE PUBLICATION
Though it controls size, performance, cost and reliability of all electronic systems, the packaging of convergent and microminiaturized systems, or “Microsystems Packaging”, has largely been evaded as an academic subject at most universities. The Fundamentals of Microsystems Packaging is perhaps the first textbook that systematically deals with the subject matter in the most fundamental way. It defines Microsystems packaging as the packaging not only of microelectronics but also of photonics, RF and MEMS devices into systems. In addition, it is the first book that deals with all the system technologies from wafer to systems and all the electrical, mechanical, and materials technologies in between. (See chapter titles below.)


SALES & ORDERING
ISBN 0-07-137-169-9

Bulk Orders (5 or more copies) may be ordered from:
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CHAPTER TITLES
1 - Introduction to Microsystems Packaging
2 - The Role of Packaging in Microelectronics
3 - The Role of Packaging in Microsystems
4 - Fundamentals of Electrical Package Design
5 - Fundamentals of Design for Reliability
6 - Fundamentals of Thermal Management
7 - Fundamentals of Single Chip Packaging
8 - Fundamentals of Multichip Packaging
9 - Fundamentals of IC Assembly
10 - Fundamentals of Wafer Level Packaging
11 - Fundamentals of Passives
12 - Fundamentals of Optoelectronics
13 - Fundamentals of RF Packaging
14 - Fundamentals of MEMS Packaging
15 - Fundamentals of Sealing and Encapsulation
16 - Fundamentals of System Level PWB Technologies
17 - Fundamentals of Board Assembly
18 - Fundamentals of Packaging Materials and Processes
19 - Fundamentals of Electrical Testing
20 - Fundamentals of Package Manufacturing
21 - Fundamentals of Microsystems Design for Environment
22 - Fundamentals of Microsystems Reliability


www.prc.gatech.edu/books