CPMT NEWSLETTER for FALL 2011

Full Newsletter (2 MB) INDEX to individual PDFs: - President's Column: elections, website, awards - Officers, Committee Chairs - CPMT Awards; New Sr Members - Call for Nominations: 2012 awards - Bylaws Changes - Distinguished Lecturer; DL Program - New CPMT Chapter: Orange County - Most-Downloaded Papers with links - Conference Review: ECTC 2011 in San Diego - Conference Review: Semiconductor Wafer Test in San Diego - Conference Info: Advanced Packaging Mtls 2011 in Xiamen, China - Conference Info: Global Interposer Tech, in Atlanta - Conference Info: 3D ICs in Irvine, CA - Conference CFP: Advanced Semiconductor Manufacturing in NY - Conference CFP: Signal Propagation on Interconnects, Sorrento - Upcoming conferences/events

SEPTEMBER 2011 NEWSLETTER (continued) UPCOMING CONFERENCES: - November 12–14: 2011 Global Interposer Technology (GIT), Atlanta, GA, USA - December 7–9: 2011 13th Electronics Packaging Technology Conf (EPTC), Singapore - December 12–14: 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Hangzhou, China - March 18–22: 2012 IEEE Semiconductor Thermal Measurement, Modeling and Management Symposium (SEMI-THERM), San Jose, CA USA - April 16–18: 2012 Int’l Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Lisbon, Portugal - May 13-16: 2012 Workshop on Signal Propagation on Interconnects (SPI), Sorrento, Italy - August 13-16: 13th Int'l Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Guilin, China (Abstracts Due by March 16) See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.

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