IEEE  Singapore Rel/CPMT/ED Chapter
of the following IEEE Societies:

Reliability (Rel),

Components, Packaging and Manufacturing Technology (CPMT) and

Electron Devices (ED).

 

 

 

 

 

 

 

 

 

 

 

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Chapter news

 Upcoming Events

Past Activities

 

Executive Committee

Andrew Tay  – Chairman     
Alastair Trigg  – Vice Chair
Tan Kok Tong – Secretary
Lim Yeow Kheng  – Treasurer          
Chin Jiann Min
Gan Chee Lip
John Thong
Vaidyanathan Kripesh
Tee Tong Yan

James How
Pey Kin Leong
Zhou Xing
Yoon Seung Wook

 

 Past Chapter Chairs

Pey Kin Leong (09)

Alastair Trigg, (‘07-’08)

Wilson Tan, (’06)

Pey Kin Leong ('04-'05)

Ong Soon Huat ('03)

MK Radhakrishnan ('01-'02)

Ong Soon Huat ('97-'00)

Daniel Chan ('95-'96)

Swee Yong Khim('92-'94)

 

 

 

 

IPFA 2011

18th IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS

Songdo Convensia, Incheon, Korea
04-07, July, 2011

 

EPTC 2011

13th Electronics Packaging TechnologyConference, December 2011 Singapore

 

 

 

 DESIGNING FOR ELECTROMIGRATION RELIABILITY

Speaker : Dr Vincent M Dwyer

Loughborough University, UK

Date : 2 March 2011, Wednesday

Time : 4:30pm

Venue : LT 9, Block NS4, NS4-04-39, NTU

EPTC 2010

 

12th Electronics Packaging TechnologyConference, December 2010 Singapore

 

More Moore and More than Moore, by Prof Simon Deleonibus, CEA-LETI, France, 14 February 2011

  

 

Previous years Activities

> Year 2006

> Year 2005

> Year 2004

> Year 2003

> Year 2002

> Year 2001

 

 Details

 Contact: Jasmine Leong                                                                                    Last Updated: 20 March 2011by Alastair Trigg