10th IEEE

 

EUROPEAN SYSTEMS PACKAGING WORKSHOP

Sponsored by the IEEE Computer Society – Test Technology Technical Council (TTTC)
and by the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society

 

January 29-31, 2007

“Grand Hotel di Como,” Como, Italy

The IEEE Technical Committee on Systems Packaging (TC-SP) wishes to invite you to its 10th European Workshop. Our goal is to view all types of packaged electronics from the macro perspective with emphasis on the overall technical system attributes, choices and challenges. This includes the product specifications, system architecture, technologies chosen, electrical performance, power design and thermal management. We approach the product characteristics by focusing on all levels of packaging which is the "glue" that holds the entire hardware system together. Consequently, designing the total package requires an intimate knowledge of all the technologies that go into the final product. This perspective leads to a broad knowledge of what's going on in all aspects of the worldwide electronics industry. So if you can't go to all the sub-specialty conferences and you want a in-depth big picture view of the latest developments in the field of electronics, you should seriously consider attending our workshops. There will also be a short tour of the ST Microelectronics labs at the conclusion of our program. The workshop will be held in English. The committee is looking forward to your participation.


Main topics of the workshop will include, but are not limited to:

 

General Chair: Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, Corso Duca Abruzzi 24, I-10129 Torino (Italy) - Tel. +39-011-564-4060; Fax +39-011-564-4099; email flavio.canavero@polito.it
 
General Co-Chair: Carlo Cognetti, ST Microelectronics - Via Camillo Olivetti 2. 20041 Agrate Brianza (MI) - Italy – Tel. +39.039.603.5456; email carlo.cognetti@st.com
 
Program Chair: Thomas-Michael Winkel, IBM Germany
 
Co-Program Chair: Cian Ó Mathúna, NMRC, University Cork College, Ireland
 
Treasurer and local arrangement: Carla Giachino, Politecnico di Torino, Italy; email: carla.giachino@delen.polito.it
 

Technical Program Committee:

Rolf Aschenbrenner (Fraunhofer IZM, Germany)
Eric Beyne (IMEC, Belgium)
Evan Davidson (IBM USA – ret.)
Christine Kallmayer (Fraunhofer IZM, Germany)
George Katopis (IBM USA)
Erich Klink  (IBM Germany)
William Samaras (INTEL USA)