The IEEE
Computer Society's and the IEEE CPMT's Technical Committee on System
Packaging will be holding its Year 2010 Systems Packaging
Japan Workshop (SPJW) in Kyoto, Japan in January, 2010. This will be
the
59th
Workshop
(13th in Japan) conducted
by the Technical Committee on System Packaging. These workshops began
as the Computer Packaging Workshop held at the Split Rock Lodge in the
Poconos Mountain Region of Pennsylvania, U.S.A. in 1968. Founded by
Jack Balde and others from Bell Labs and IBM, they were the first IEEE
meetings solely devoted to the design of and the technologies used in
electronic packaging and their integration with the semiconductors to
form the system product.
Initially, these
workshops focused on in-depth discussions of component choices, design
trade-offs for system-level optimization, system-level performance and
the underlying electrical, mechanical and cooling technologies used in
computers and telecommunications equipment. Over the years the emphasis
has changed to include more recent system development activities in
Personal Computing, Workstations, Servers, Telecommunications,
Wireless, Portable, Automotive, Military, Aerospace, MEMS, Medical,
etc.
Because of today's plethora of packaging meetings (mainly covering the
component, materials, modeling and processing spectrums), the Systems
Packaging Technical
Committee now focuses on the trade-offs required for good system
design. Typical topics include packaging systems, functional
partitioning, signal I/O requirements, electrical design, cooling
techniques, technology processes, reliability, cost, and overall system
performance.
The goal of our
workshops is to maximize the exchange of system-level packaging
concepts and experiences for new and future products. We do not have
concurrent sessions. This enables each attendee to participate in all
the workshop's activities. Normally this facilitates enlightening and
stimulating discussions for the benefit of the attendees and
their affiliated organizations. Attendance varies between fifty and
one-hundred people.
In accordance
with IEEE workshop rules, no proceedings are published and cameras and
tape recorders are strictly prohibited to encourage a spirited
interchange of new information. In addition, attendance by the trade
press is not normal and there are no commercial sponsorships or a
"trade show" display floor. The only meeting record is a CPMT
Newsletter summary provided by the organizing committee.
The committee
invites you to attend the next Japanese Workshop in Kyoto. We also
encourage you to ask others to attend from your organization or from
other companies or universities. It is only through your efforts that
we can reach out to new people to keep the Systems Packaging Technical
Committee and its workshops vital. Overall you will find the Systems
Packaging Workshops to be a career enriching "big picture" worldwide
view of electronic products. We think you'll enjoy attending.