2007 IEEE CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA
VANCOUVER BC, CANADA
OCTOBER 14-17, 2007

IEEE-CEIDP 2007

S T U D E N T   S U P P O R T

SUBMIT PAPER

     

 

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Student Support
Executive Committee
CEIDP Board

 

 

 

The CEIDP provides a limited number of stipends in the amount of US $300 to full-time students to encourage their participation in the Conference. The stipend is contingent upon the following conditions: 1) the student must be an author or coauthor of a paper accepted for presentation at the Conference, and 2) the student must present or co-present the paper at the Conference. The CEIDP reserves the right to limit the number of student stipends allocated to a single research group or institution. To apply for a student stipend, the following information should be sent by e-mail message to Isidor Sauers, Conference Chair, by June 30, 2007:

  • Your full name, e-mail and mailing address
  • The full name, e-mail and mailing address of your faculty supervisor
  • The title and ID number of your CEIDP paper
  • Confirmation of your status as a full-time student from your faculty supervisor.

Stipend applications received by June 30, 2007 will be notified on or about July 31, 2007. Stipend applications received after June 30 will be handled a on first come basis if funds are available. Late applicants will be notified within a month of the receipt of their requests. The stipends will be awarded on the last day of the Conference. For further information contact Isidor Sauers, Conference Chair.