Call for Papers!

Signal Integrity Column to Debut in the New
IEEE Electromagnetic Compatibility Magazine

Signal and power integrity are an integral part of high-speed design to address electromagnetic compatibility issues in modern electronic, computer, and communication systems. Technical Committee 10, Signal Integrity, has grown into one of the largest and the most active technical committees of the EMC Society. Accordingly, the Technical Advisory Committee has decided to start a special column for signal integrity, starting with the first issue of the new EMC Magazine in the first quarter 2012. I cordially invite researchers, engineers, and students in the field of signal and power integrity to submit papers to this column. All submissions will be subject to peer review. The accepted papers will be uploaded into the IEEE Xplore database and become refereed journal publications.

Both new contributions and review papers are welcome. There’s no strict page limit, but a length of four pages in the standard IEEE format is preferred. Potential topics include, but are not limited to, the following technical areas:

• High-speed channel characterization, jitter and bit-error-rate
  
• Passive channel modeling in multilayer packages and PCBs
  
• Material extraction and characterization
  
• Power distribution network
  
• Model extraction and model order reduction
  
• Signal/power integrity and EMI co-design
  
• IC EMC and SI models
  
• 3D packaging and TSV
  
• High-speed connectors and cables
  
• New simulation and measurement techniques

Ideal papers for this new column are practical in nature. The goal is to provide a resource of practical papers on signal integrity topics that engineers can use on the job, in the “real world” so to speak. Keep in mind that papers describing new research, or those that are theoretical in nature, are better suited for publication in the IEEE Transactions on EMC.

Meet Our Associate Editor for the New Signal Integrity Column

Jun Fan (S’97-M’00-SM’06) received his B.S. and M.S. degrees in Electrical Engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively. He received his Ph.D. degree in Electrical Engineering from the University of Missouri-Rolla in 2000. From 2000 to 2007, he worked for NCR Corporation, San Diego, CA, as a Consultant Engineer. In July 2007, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), and is currently an Assistant Professor with the Missouri S&T EMC Laboratory. His research interests include signal integrity and EMI designs in high-speed digital systems, dc power-bus modeling, intra-system EMI and RF interference, PCB noise reduction, differential signaling, and cable/connector designs. Dr. Fan served as the Chair of the IEEE EMC Society TC-9 Computational Electromagnetics Committee from 2006 to 2008, and was a Distinguished Lecturer of the IEEE EMC Society in 2007 and 2008. He currently serves as the Vice Chair of the Technical Advisory Committee of the IEEE EMC Society. Dr. Fan received the IEEE EMC Society Technical Achievement Award in August 2009.