Power Electronics

Packaging of Power Devices

Packaging of power devices involves technology of material, fabrication process, thermal management, and optimization of layout with related to electrical performance of the devices.

 

The packaging concept today has been extended to integrate intelligence in a power module. An example of this concept is the PEBB (Power Electronics Building Block), Its objective is to have an intelligent power devices packaged in such a way that it can provide commonalty to a power electronics system, a user-friendly interface, and accessibility to telecommunication and control. A multilayer structure is used to minimize the parasitic components, which is essentially for high frequency applications. Function blocks such as protection, diagnosis are integrated.

 

Research topics are:

• Electrical structure/function identification
• Packaging structure development
• Thermal distribution analysis
• Parasitics extraction for both optimized packaging design and electrical performance
• EMI reduction
• User-friendly interface

 

 

 

The webmaster can be reached at
pels-webmaster@ieee.org
© 2008 IEEE Power Electronics Society