Women in Engineering / Young Professional Event

Atsuyoshi Koike
Western Digital / SanDisk Limited

Biography: ATSUYOSHI KOIKE has served as senior vice president covering technology and fab operations since 2006. He leads Western Digital's SanDisk Japan operations, including overseeing the company's leading-edge 2D NAND and 3D NAND R&D and manufacturing operations in Japan. In this role, he also oversees Western Digital's joint ventures with Toshiba Memory Corporation.

Koike has over 30 years of experience driving innovations in the semiconductor industry. Prior to joining SanDisk (now Western Digital), he served as corporate chief engineer for Renesas Technology Corporation. Previously, he held the position of president and chief executive officer, as well as other senior leadership positions at Trecenti Technologies, Inc., where he successfully established the world's first 300mm wafer fab featuring all single wafer processing. Prior to that, he held senior manufacturing management and executive leadership positions at Hitachi, Ltd., where he focused on technological development in the semiconductor division, contributing to pivotal technological innovations for its mainstream semiconductor products for about two decades.

Koike received the B.S. and M.S. in Materials Science and Engineering from Waseda University and Ph.D. in Electronic Engineering from Tohoku University. He is a frequent public speaker and has given lectures at the University of Tokyo and Hitotsubashi University.