Plenary Speakers

 

Prof. Albert Chin

Title: Technologies Toward Three-Dimensional Brain-Mimicking IC Architecture

Abstract: Although device downscaling will soon reach the quantum limit, the speed and power are still the hard challenges for advanced ICs. To address these speed and power issues, we pioneered the three-dimensional (3D) IC in 2004. In contrast to few interconnects of package-level 3D IC, device-level high-mobility nMOS on VLSI backend, unipolar nMOS logic with CMOS-like ultra-low DC power, narrow distribution RRAM, and high-speed ferroelectric nMOS memory are the enabling technologies toward brain-mimicking IC architecture.

Biography: received Ph.D. from University of Michigan. He was with AT&T Bell Labs, General Electric E-Lab and Texas Instruments SPDC. He is a Chair Professor of National Chiao Tung University. He is a pioneer on low DC-power high-k CMOS and high-k Flash memory, low switching-power 3D IC, high RF-power asymmetric-MOSFET, Si THz devices, and resonant-cavity photo-detector. He co-authored >500 papers, 1 Top 100 Scientific Reports Physics papers in 2017, and 7 Highly Cited Papers. Dr. Chin has served as Subcommittee Chair and Asian Arrangements Chair of IEDM Executive Committee, Editor of IEEE Electron Device Letters, IEEE ED Society SRC Chair, and two Technical Committee Chairs on Electronic Materials and Compound Semiconductor Devices & Circuits. He is an IEEE Fellow, Optical Society of America Fellow, and Asia-Pacific Academy of Materials Academician.