Invited Speakers

 

Milind Shah
Sr. Director, Engg. IC Packaging Qualcomm

Title: Module/SiP Package Trends

Abstract: Module/SiP Trends for mobile phone esp. w/ 5G functionality coming in 2019-2020 time-frame. Real estate will be premium for mobile phones and determined by screen size in length and battery will take most of the space. Presentation will discuss trends and benefits of doing SiP/Modules and fit in the same mother board space

Biography: Milind Shah is Sr. Director,Engg. is currently working on System in Package (SiP) technologies to enable 5G, IoT, Automotive sub-systems modules and technologies such as fine pitch flip chip (TCFC, CuBOL) as well as new package structures such as PoP, Hybrid flip chip. His group is responsible for early development through HVM deployment for products. Prior to joining Qualcomm Milind spent nine years at RFMD developing packages for RF front end modules, conformal shielding, and embedded actives. Milind has an MSME degree from Florida International University and is an inventor on 30 issued patents.