Tutorial C

 

CHIH-HANG TUNG, TSMC, Hsinchu, Taiwan

Title: Advanced Packaging Technology for More Moore and More than Moore

Abstract: An old name with a new meaning, advanced packaging technology has emerged as a new way of achieving continuous microelectronics devices function/value improvement that was previously sustained by Moore's Law transistor scaling for over 50 years. This tutorial starts by delineating the background challenges with Moore's Law and the semiconductor industry as a whole, including existing packaging technology and supply chain. This is followed by showing new market driving forces calls for new packaging technologies with value proposition, and how the eco-system/supply-chain evolved with the new market drivers. Next, a broad review on innovative packaging technology platforms proposed by academia, foundry, and OSAT is presented. Finally, the challenges that arise as the new system integration technology platforms evolve to meet the new market diversification, including IoT, Autonomous Driving, AI and Machine Learning, and also other forward-looking applications are discussed.

Biography: Chih-Hang TUNG has worked in Taiwan and Singapore semiconductor industry for more than 30 years. His expertise areas span from front-end ultra-thin gate dielectric and high-k metal-gate breakdown mechanism, to middle end silicide and Schottky barrier contacts, to back-end-of-line Cu and low-k, and to far-back-end 3DIC and advanced packaging. He has authored/co-authored for more than 200 technical papers (in IEDM, VLSI, IRPS, APL, JAP, EDL, TED, ...) 30+ world-wide patents, and a book “ULSI Semiconductor Technology Atlas (Wiley 2003).” Chih-Hang obtained his Master degree from Illinois Institute of Technology in Chicago in 1987. He has served IEEE IPFA as Technical Chair, and General Chair 2004-2008, and EDTM committee, 2018&2019. He has received IEEE EDS Paul Rappaport Award 2008. Chih Hang joined TSMC R&D in 2008 and currently leads the Exploratory 3D Program in TSMC.