Tutorial D

 

Tam Lyn Tan, GlobalFoundries Singapore

Title: Progress in Back-End-Of-Line: Materials, Process and Reliability

Abstract: BEOL reliability is becoming more challenging as we advance from technology node to technology node. New materials, new process and tools were introduced to meet the scaling demands and RC performance requirements. As more metal layers are introduced, with line width and metal spacing reduced, process control and variability becomes critical. Therefore, it is important to understand the materials and integration schemes; characterize reliability and explore new methods/models to accurately project reliability lifetimes.
This tutorial will cover BEOL reliability physics fundamentals and failure mechanisms of EM, inter-metal and intra-metal low-k dielectric breakdown and stress migration. BEOL reliability challenges and process variability management will also be discussed.

Biography: Tam Lyn Tan received B. Eng. (Hons.) degree in Materials Science and Engineering from Nanyang Technological University, Singapore, in 2004 and Ph.D. from the same university in 2008. Currently, she is Member of Technical Staff at GLOBALFOUNDRIES’s reliability team, with experience in BEOL interconnects reliability, gate oxide reliability as well as reliability of passive devices such as MIM capacitor, resistor and diodes. Tam Lyn was publication chair for IEEE IPFA in 2014 and served as IPFA technical committee member from 2018.