Logic Technology
Biography: Kim bong-seok is a semiconductor technology development expert with more than 30 years of experience. He worked in R&D for 26 years as a logic process and device integration at Samsung Semiconductor. At Samsung, he led the research and development of several standard logic technology over 13 generations. He was responsible for technology ownership, such as creating manufacturing specifications, process/device optimizing, verifying technologies, and yield improvement to meet PPAC requirement. He served as vice president of Samsung Systems LSI TD Center (Foundry Div.) and successfully developed and produced 32/28nm HK/MG and 14nm 3D FinFET technologies. He also has deep insight to describe and validate technologies such as integration flow, device technologies, IP design optimization(DTCO), test pattern design, and unit process/modules (Fin, Gate, Epi, HK/RMG, CNT, BEOL). Currently, the cutting-edge foundry mass-production technology node is 3nm and 2nm is under research and development. His current interests next-generation devices and integration those are GAA nanosheets and 3D integration (including smart PKG solution) for logic and memory. He also gave several lectures on logic semiconductor manufacturing and device technology. He holds 15 semiconductor manufacturing patents and has written 12 papers. He was awarded the proud Samsung Award, the highest honor in Samsung, and the Minister of Knowledge Economy Award for green energy-saving technology.