Invited Speaker

Advanced Power Technology and Package

Ben(ByongJin) Kim (onsemi)

Biography: Byong Jin has 20+ years’ experience in semiconductor package and technology and also power solution technology in onsemi. His prior experience includes various types of package designs and advanced package development including SiP and power package/ technology development. He has more than 30 granted patents & several publications and holds MD in material science and engineering from Inha University in Korea.