Invited Speaker

Advanced Interconnection Technologies in Semiconductor Packaging

Chung Eunyong (Intel)

Biography: EY (Eun Yong-Chung) Chung is a Package R&D Engineer of Assembly & Package Management in External Manufacturing Production of Intel Corp with responsibilities for NPI development and Ramp/HVM management. He has over 16 years’ experience in the IC Assembly/Packaging substrate and material industry and has spent most of that time in new/advanced substrate/assembly material development and thermal-mechanical interaction management. Prior to joining Intel, EY was at LG electronics, Doosan R&D center Korea & Japan. EY holds a MS degree in Chemical Engineering.