Invited Speaker

Interposer Trends and Technologies of Heterogeneous Integration

Gu-sung Kim (Kangnam University)

Biography: 1989 ~ 2005 IPT, Memory Device, Samsung Electronics
- Advanced Package Research and Development (3D IC, WLP, FC IC for Memory/Logic, WL Line PCCB Dir.)
- IEEE/SEMI/IMAPS Activities

2006 ~ Pres. Kangnam University, Korea, Electronics Packaging Research Center
-Professor at Lib. Arts/IoT EE/KICF (Kangnam Industry-Academic Coorporation Foundation)
- Deputy Director of EPRC (Electronic Package Research Center)
- Chair of Board at EPMS (Electronic Packaging Mission Society)
- Member of Board (BoG) at IEEE EPS (Electronics Packaging Society)
- Member of The Korea Industrial Technology Security Council
- Chair of IEEE EPS Korea Chapter
- VP of KSDT (The Korean Society of Semiconductor and Display Technology)
- VP/Exe Dir of KMEPS (The Korea Microelectronics and Packaging Society)
- Chair of KSIA/KSDT Semiconductor Assembly Roadmap (2009~)
- Founder/CEO of EPWorks Co. Ltd. and VP of Hana Micron, Korea (2007~2017)
- IMAPS - IAAC President  (2017)