Plenary Speaker

Semiconductor Scaling for the Next Decade Enabled by Holistic Lithography

Michael Lercel (ASML)

Experience:

Biography: Experience in many parts of semiconductor manufacturing with particular emphasis on lithography and patterning topics. Has worked on many “next generation lithography” techniques – including first EUV work in 1998. PhD in physics from Cornell University in using ebeam lithography on monomolecular self-assembled films. Currently working on corporate strategy, product portfolio, and (as always) customer impact

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