Invited Speaker

Enhanced Thermo-mechanical Reliability of High Bandwidth Memory through Mass Reflow Bonding and Molded Underfill

Sangyong Lee (SK Hynix)

Biography: Dr. Sangyong Lee is a Principle Engineer in Package Development at SK hynix. He received the Ph.D in material science and engineering from Korea Advanced Institute of Science and Technology (KAIST). He joined SK hynix in 2010 and has been working on development of process for advanced DRAM packages. His research interest includes advanced package substrate, Though Silicon Via (TSV), wafer level packaging, and 2.5D/3D SiP.