Tutorial Speaker

Introduction to Advanced Packaging Technology for Heterogenous Integration

Sarah Eunkyung Kim (Seoul National University of Science and Technology)

Biography: Sarah Eunkyung Kim (Ph.D.), a professor of the Department of Semiconductor Engineering, Seoul National University of Science and Technology, received her B.S. from Materials Science and Engineering at Rensselaer Polytechnic Institute and M.S. from Materials Science and Engineering at Massachusetts Institute of Technology and Ph.D. from Materials Science and Engineering at Rensselaer Polytechnic Institute. Prior to join Seoul National University of Science and Technology, she worked at Samsung Electronics, Intel, and Korea Institute of Science and Technology. In Intel she has worked on various areas of BEOL interconnect, 3D integration, and die-package interface development including liquid cooling, thick metal interconnect, and decoupling capacitor. Also, she led multiple wafer level package projects and managed Sort test group. At university, Sarah has been working on 3D packaging integration, hybrid bonding, and transparent oxide semiconductor. She holds more than 30 US patents including one of Intel's 45nm-node core patents and has numerous technical papers in international journals and received many honors and awards over the years (https://esl.seoultech.ac.kr).