Keynote Speaker

Micro-Bumping vs. Hybrid Bonding: 3D IC Full-Chip PPA and Reliability Comparisons

Sung-Kyu Lim (Georgia Tech)

Biography: Prof. Sung Kyu Lim received Ph.D. degree from UCLA in 2000. He joined the School of Electrical and Computer Engineering at the Georgia Institute of Technology in 2001, where he is currently Motorola Solutions Foundation Professor. His research focus is on the architecture, design, and electronic design automation for 2.5D and 3D ICs. He has published more than 400 papers on the topics. He received the Best Paper Award from the IEEE Transactions on Electromagnetic Compatibility in 2021 and the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems in 2022. He began serving as a program manager for the US Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office (MTO) since 2022.