Invited Speaker

Strategies for Mechanically Reliable Thin-Film Electron Devices

Taek-Soo Kim (KAIST)

Biography: Prof. Taek-Soo Kim joined the Department of Mechanical Engineering at KAIST in December 2010. Since then he has been directing Advanced Packaging and Thin Film Lab at KAIST (https://aptf.kaist.ac.kr). His research group focuses on mechanics-related subjects of advanced packaging and thin films: adhesion, deformation, fracture, fatigue, reliability, and stress/strain induced multiphysics phenomena. He received a BS degree in Mechanical Engineering in 2001 from Yonsei University, and MS and PhD degrees in Mechanical Engineering in 2006 and 2010, respectively, both from Stanford University.