Invited Speaker

A Closer Look to Fan-out Panel Level Packaging

Tanja braun (Fraunhofer IZM)

Biography: Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins. Tanja Braun is head of the group Assembly & Encapsulation Technologies. Recent research is focused on fan-out wafer and panel level packaging technologies and Tanja Braun is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin. Results of her research concerning packaging for advanced packages have been presented at multiple international conferences. Tanja Braun holds also several patents in the field of advanced packaging. In 2014 she received the Fraunhofer IZM research award and in 2021 the Exceptional Technical Achievement Award from IEEE Electronics Packaging Society (EPS) and the IMAPS Sidney J. Stein Award. Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governor (BOG) and the IEEE EPS Region 8 Program Director.