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2008 IEEE International Ultrasonics Symposium (IUS)
Beijing International Convention Center (BICC)
Beijing, China, November 2-5, 2008 (View: Conf. Photos/Videos and * Confucius * Beijing Photos * Color Picture * )
* IEEE UFFC *
Sponsored by the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society
 * IEEE *
In Cooperation with the Acoustical Society of China and the Institute of Acoustics, Chinese Academy of Sciences

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Technical Program Committee (TPC) (136 Members)

Group 1: Medical Ultrasonics
  Vice Chair of TPC:
  Stanislav Emelianov, Ph.D.
  University of Texas at Austin
  Austin, Texas, U.S.A.

  Members:
  1. Olivier Basset: CREATIS, Universit?Lyon I, France
  2. Geneviève Berger: National Centre for Scientific Research (CNRS), France
  3. Ayache Bouakaz: INSERM, Universit?Tours, France
  4. Charles Cain: University of Michigan, USA
  5. Richard Chiao: Siemens Medical Solutions, USA
  6. Jan D'hooge: Catholic University Leuven, Belgium
  7. Paul Dayton: UNC Chapel Hill and NC State University, USA
  8. Emad Ebbini: University of Minnesota, USA
  9. David Evans: University of Leicester, UK
  10. Kathy Ferrara: University of California Davis, USA
  11. Stuart Foster: University of Toronto, Canada
  12. James Greenleaf: Mayo Clinic College of Medicine, USA
  13. Anne Hall: General Electric Medical Systems, USA
  14. Christopher Hall: Philips Research North America, USA
  15. Peter Hoskins: The University of Edinburgh, UK
  16. John Hossack: University of Virginia, USA
  17. Kullervo Hynynen: University of Toronto, Canada
  18. Michael F. Insana: University of Illinois, Urbana-Champaign, USA
  19. Jorgen Jensen: Technical University of Denmark, Denmark
  20. Nico de Jong: Erasmus Medical Centre and University of Twente, The Netherlands
  21. Hiroshi Kanai: Tohoku University, Japan
  22. Jeff Ketterling: Riverside Research Institute, USA
  23. Michael Kolios: Ryerson University, Canada
  24. Chris de Korte: Radboud University Nijmegen Medical Centre, The Netherlands
  25. Nobuki Kudo: Hokkaido University, Japan
  26. Pai-Chi Li: National Taiwan University, Taipei, Taiwan
  27. Jian-yu Lu: University of Toledo, USA
  28. Leonardo Masotti: Universit?degli Studi di Firenze, Italy
  29. Tom Matula: University of Washington, USA
  30. James G. Miller: Washington University in Saint Louis, USA
  31. Kathy Nightingale: Duke University, USA
  32. William O'Brien: University of Illinois, Urbana-Champaign, USA
  33. Georg Schmitz: Ruhr-Universität Bochum, Germany
  34. Ralf Seip: Philips Research North America, USA
  35. Mickael Tanter: Laboratoire Ondes et Acoustique, ESPCI, France
  36. Tom Thomas: Boston Scientific, Inc., USA
  37. Kai Thomenius: General Electric's Corporate R&D, USA
  38. Hans Torp: Norwegian University of Science and Technology, Norway
  39. Piero Tortoli: Universit?degli Studi di Firenze, Italy
  40. Ton van der Steen: Erasmus Medical Center, The Netherlands
  41. Keith Wear: US Food and Drug Administration, USA

Group 2: Sensors, NDE, and Industrial Application
  Vice Chair of TPC:
  Jafar Saniie, Ph.D.
  Illinois Institute of Technology
  Chicago, Illinois, U.S.A.

  Members:
  1. Robert C. Addison: Rockwell Science Center, USA
  2. Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany
  3. Nihat Bilgutay: Drexel University, USA
  4. Ramazan Demirli: Canfield Scientific, USA
  5. Eric S. Furgason: Purdue University, USA
  6. David Greve: Carnegie Mellon University, USA
  7. Edward Haeggstrom: University of Helsinki, Finland
  8. Jacqueline Hines: Applied Sensor Research and Development Corporation, USA
  9. Fabien J. Josse: Marquette University, USA
  10. Lawrence W. Kessler: Sonoscan Inc., USA
  11. Pierre T. Khuri-Yakub: Stanford University, USA
  12. Mario Kupnik: Stanford University, USA
  13. Jun-ishi Kushibike: Tohoku University, Japan
  14. Roman Maev: University of Windsor, Canada
  15. Kentaro Nakamura: Tokyo Institute of Technology
  16. Massimo Pappalardo: University di Roma TRE, Italy
  17. Tony Sinclair: University of Toronto, Canada
  18. Bernhard Tittman: Pennsylvania State University, USA
  19. Jiromaru Tsujino: Kanagawa University, Japan
  20. John F. Vetelino: University of Maine, USA
  21. Paul Wilcox: University of Bristol, UK
  22. Donald E. Yuhas: Industrial Measurement Systems, Inc., USA

Group 3: Physical Acoustics
  Vice Chair of TPC:
  Yook-Kong Yong, Ph.D.
  Rutgers University
  Piscataway, New Jersey, U.S.A.

  Members:
  1. Robert Aigner: TriQuint Semiconductor, USA
  2. Art Ballato: U.S. Army, USA
  3. Jan Brown: JB Consulting, USA
  4. Weiqiu Chen: Zhejiang University, China
  5. David Hecht: DLH Consulting, USA
  6. Fred Hickernell: Retired from Motorola, USA
  7. Yonkee Kim: U.S. Army, USA
  8. Amit Lal: Cornell University, USA
  9. C.S. Lam: Epson Electronics America, Inc., USA
  10. John Larson: Avago Technologies, USA
  11. Moises Levy: Department of Physics, Naples, Florida, USA
  12. George Mansfeld: Russian Academy of Sciences, Russia
  13. Vitold Poghar: Scientific and Technological Center of Unique Instrumentation of Russian Academy of Science, Russia
  14. Valeri Proklov: Institute of Radio Engineering & Electricity, Russia
  15. Edgar Schmidhammer: EPCOS, Germany
  16. Susan Schneider: Marquette University, USA
  17. Bikash Sinha: Schlumberger-Doll Research, USA
  18. Ji Wang: Ningbo University, China
  19. Qing-Ming Wang: University of Pittsburgh, USA

Group 4: Microacoustics - SAW, FBAW, MEMS
  Vice Chair of TPC:
  Peter Smith, Ph.D.
  McMaster University
  Hamilton, Ontario, Canada

  Members:
  1. Sylvain Ballandras: LPMO, France
  2. Kushal Bhattacharjee: RF Micro Devices, USA
  3. Sergey Biryukov: Leibniz Institute for Solid State and Materials Research Dresden (IFW), Germany
  4. Jidong Dai: RF Monolithics, USA
  5. Yasuo Ebata: Fujitsu Media Device Ltd., Japan
  6. Gernot Fattinger: Sawtek, USA
  7. Ken-ya Hashimoto: Chiba University, Japan
  8. Daniel Hauden: CNRS_LPMO, France
  9. Mitsutaka Hikita: Kogakuin University, Japan
  10. Chunyun Jian: Nortel Networks, Canada
  11. Jyrki Kaitila: Infineon, Germany
  12. Jan Kuypers: University of California, USA
  13. Ken Lakin: TFR Technologies, USA
  14. Don Malocha: University of Central Florida, USA
  15. David Morgan: Impulse Consulting, UK
  16. Hiroyuki Odagawa: Tohoku University, Japan
  17. Mauricio Pereira da Cunha: University of Maine, USA
  18. Viktor Plessky: GVR Trade SA, Switzerland
  19. Bob Potter: Vectron International, USA
  20. Leonard Reindl: Albert-Ludwigs-University Freiburg, Germany
  21. Arne Ronnekleiv: Norwegian Institute of Technology, Norway
  22. Richard Ruby: Avago Tech, USA
  23. Clemens Ruppel: EPCOS AG - SAW RD SAM, Germany
  24. Takahiro Sato: Samsung, Japan
  25. Marc Solal: Sawtek, USA
  26. Robert Weigel: Friedrich-Alexander University, Germany

Group 5: Transducers and Transducer Materials
  Vice Chair of TPC:
  Scott Smith, Ph.D.
  GE Global Research
  Niskayuna, New York, U.S.A.

  Members:
  1. Sandy Cochran: University of Dundee, UK
  2. Christopher Daft: Siemens Medical Solutions, USA
  3. Levent Degertekin: Georgia Institute of Technology, USA
  4. Charles Emery: Mirabilis Medica, USA
  5. John Fraser: Philips Medical Systems, USA
  6. Jean-Francois Gelly: GE Healthcare, France
  7. Reinhard Lerch: Friedrich-Alexander-Universität Erlangen-Nuremberg, Germany
  8. Geoff Lockwood: Queen's University, Canada
  9. Clyde Oakley: W. L. Gore, USA
  10. Omer Oralkan: Stanford University, USA
  11. Paul Reynolds: Weidlinger Associates, USA
  12. Yongrae Roh: Kyungpook National University, Korea
  13. Ahmad Safari: Rutgers University, USA
  14. Mark Schafer: Sonic Tech Inc., USA
  15. Thomas Shrout: Pennsylvania State University, USA
  16. Kirk Shung: University of Southern California, USA
  17. Stephen Smith: Duke University, USA
  18. Wallace Smith: Office of Naval Research, USA
  19. Yasuhito Takeuchi: Kagoshima University, Japan
  20. Vasandara Varadan: University of Arkansas, USA
  21. Jian Yuan: Boston Scientific, USA
  22. Qiming Zhang: Pennsylvania State University, USA
  23. Qifa Zhou: University of Southern California, USA

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