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Technical Seminar

Signal Integrity Consideration & Analysis

DIRECTIONS  From I-25, take Harmony Road Exit (Exit 265) westbound, and enter Agilent/HP campus on right.  Agilent/HP campus is on the NE corner of Harmony Road and Ziegler Road.  Proceed to Bldg. 1 Lobby to sign-in and meet host for escort to Auditorium.

ABSTRACT  This tutorial is designed to provide engineers with a practical framework for understanding and performing high-speed measurements.  The talk starts with a brief introduction to ideal (lossless) and lossy transmission lines, interconnects, and the use of time-domain reflectometry (TDR) and vector network analysis (VNA) techniques for high-speed measurements.  Bandwidth and risetime considerations are addressed, followed by a detailed discussion of signal integrity considerations (ground bounce, power bus decoupling, dispersion loss, AC loss, differential pairs, common/differential modes, even/odd modes).  The talk continues with a discussion of board-level interconnect components (vias, connectors, sockets, probe tips, packages, multichip modules, PCB traces, single/differential runs) and concludes with high-speed interconnect modeling considerations.

Minh Quach received his B.S.E.E. degree from Oregon State University, Corvallis, OR.  He joined the Hewlett-Packard Company, Corvallis, OR, where he worked in RF and Microwave Test Engineering for four years and in Product and Test Technology & Development Engineering for two years.  In 1998, he transferred to Fort Collins, CO, where he is now Senior Test Technology & Development Engineer at Agilent Technologies (spun off from Hewlett-Packard in 1999).  Mr. Quach has authored five technical publications in the area of IC test, and was co-recipient of the Best Paper Award at the International Test Conference in 1999.  He is frequently involved in training the technical and manufacturing staff at Agilent on high-speed test and measurement.