|
WMED 2010
Home
Call For Papers
Registration
Workshop Awards
Technical
Program
Workshop
Presentations
Workshop
Photographs
Management
Committee
Past Invited Speakers
Boise Area
Information
|
|
Since the inception of this workshop, we have been
able to bring in the leaders from the industry and academia as invited
speakers to provide insight into the state-of-the-art of technology related
to micro- and nono-electronics. In
recent years, we have been able to offer parallel tutorials at the workshop
to promote in-depth discussions on relevant topics.
Here is the list of past invited speakers at WMED:
WMED INVITED SPEAKERS
AND TOPICS
|
2002
|
Prof.
Hiroshi Iwai, Frontier, Tokyo Institute of Technology (Keynote)
|
|
|
Eric
Fossum, Micron Technology, Inc.
|
|
|
Jake
Baker, Boise State University
|
|
|
Sunit
Tyagi, Intel Corporation
|
|
|
Trung
Doan, Micron Technology, Inc.
|
|
|
|
|
2004
|
Dr.
Steven Hillenius, Agere Systems, "The Future of Silicon
Microelectronics" (Keynote)
|
|
|
Dr.
H. Rhodes, Micron Technology, Inc., "CMOS Imager Technology Shrinks
and Image Performance"
|
|
|
Dr.
Gary Bronner, IBM, "Scaling Trends in DRAM Technology"
|
|
|
Prof.
Albert Wang, Illinois Institute of Technology, "A Review of RF ESD
Protection Design"
|
|
|
Dr.
Carlos H. Diaz, TSMC, "CMOS Technology for MS/RF SoC"
|
|
|
Prof.
Paul S. Ho, University of Texas, Austin,
"Packaging Effect on Reliability of Cu/low k Interconnects"
|
|
|
Prof.
Junichi Murota, University
of Tohuku,
"Atomically Controlled Processing for Future Si-Based Devices"
|
|
|
Dr.
Luan C. Tran, Micron Technology, Inc., "Beyond Nanoscale DRAM and
Flash - Challenges and Opportunities for Research in Emerging Memory
Devices"
|
|
|
|
|
2005
|
Prof.
Paul Yu, University of California, San
Diego, “Optoelectronic Devices for Wireless
Broadband Communications”
|
|
|
Prof.
Ilesanmi Adesida, University
of Illinois, “GaN
Nanoelectronics: Promises and Prospects”
|
|
|
Dr.
Gennadi Bersuker, Sematech, “High-K Gate Dielectrics”
|
|
|
|
|
2006
|
Al
Fazio, Intel Corporation, "Future Directions of Non-Volatile Memory
Technologies" (Keynote)
|
|
|
Dennis
Hess; Georgia Tech, "Preserving Low-k Dielectrics During Photoresist
and Etch Residue Removal"
|
|
|
Karl
Strauss, Flight Avionics Systems, Jet Propulsion Laboratory, "Lest We
Never Forget: A Historical Perspective of Space Data Recorders; A
Prediction for the Future"
|
|
|
Neil
Goldsman; University of Maryland at College
Park, "Physics Based Modeling and Design of
Chips, Devices, and Nanostructures: Present and Future"
|
|
|
|
|
2007
|
Dr.
Hans Stork, Sr. VP & Chief Technology Officer, Texas Instruments, "Technology
Challenges for CMOS Density Scaling" (Keynote)
|
|
|
Prof.
Jamal Deen, McMaster
University,
"Noise Issues in CMOS Devices and Circuits"
|
|
|
Prof.
Juin J. Liou, University of
Central Florida,
"ESD Protection in CMOS Technology"
|
|
|
Dr.
Prashant Majhi, SEMATECH/Intel - "CMOS Scaling Beyond High k-Metal
Gates: Opportunities and Challenges"
|
|
|
Dr.
Nety Krishna, Applied Materials, "The Role of Equipment and New
Materials in Emerging Non-Volatile Memories"
|
|
|
|
|
2008
|
Dr.
Gurtej Sandhu, Micron Technology, Inc., "Trends, Challenges and
Opportunities in Semiconductor Memory Technology Scaling" (Keynote)
|
|
|
Dr.
Krishna Parat, Intel Corporation, "NAND Flash Memory Scaling - Key Challenges
and Future Outlook".
|
|
|
Prof.
Vivek Subramanian, Univ.
of California Berkeley,
"Printed electronics for low-cost tags and sensors"
|
|
|
Dr.
Ken MacWilliams, Applied Materials , "Emergence of double patterning and
in particular self aligned double patterning for the 32nm half pitch and
below"
|
|
|
Dr.
Hector De Los Santos,
CEO, Nano MEMS, "Nano MEMS and its Applications"
|
|
|
|
|
2009
|
Dr.
Vijay Kapur, President and CEO, International Solar Electric Technology,
Inc. “Commercialization of ‘Ink Based’ and Low Cost CIGS Solar
Cells/Modules” (Keynote)
|
|
|
Dr.
Jeffrey Welser, Director, SRC Nanoelectronics Research Initiative, “The
Semiconductor Industry’s Nanoelectronics Research Initiative: Motivation
and Challenges”
|
|
|
Dr.
Daniel C. Edelstein, IBM Fellow and Manager, IBM T.J.
Watson Research
Center,
“Integration/Reliability Issues for Cu/Low-k BEOL Interconnects”
|
|
|
Prof.
Veena Misra, North Carolina
State University,
“Application of High-k Dielectrics in Memory, Power and Emerging
Technologies”
|
INVITED
TUTORIAL SPEAKERS AND TOPICS
|
2005
|
Prof.
Jake Baker, Boise
State University,
“Design of High-Speed CMOS Op-Amps for Signal Processing”
|
|
|
Dr.
Paul Dodd, Sandia National Laboratory, “Single-Event Effects in Scaled
Technologies: Getting Down to Earth with Radiation Effects”
|
|
|
Dr.
Larry Moresco, DFX Solutions “Advanced Microelectronic Packaging: Materials
and Structures”
|
|
|
|
|
2006
|
Christopher
L. Henderson; President, Semitracks, Inc., "Current Reliability and
Failure Analysis Issues for High Volume Memory Products"
|
|
|
Nozad
Karim; VP, App. Engrg. & Characterization, Amkor Technology, "3D
Memory Packaging Technologies & Trends"
|
|
|
|
|
2007
|
Dr.
Charlie Zhai, Advanced Micro Devices, "Stress Simulation of
Semiconductor Devices and Packaging"
|
|
|
Dr.
Kenneth Goodson, Stanford
University
"Nanoscale Thermal Management for Advanced Integrated Circuits"
|
|
|
Dr.
Hanmant Belgal, Intel/IM Flash Technologies, "Reliability of
Floating-Gate Flash Memories"
|
|
|
|
|
2008
|
Prof.
Cary Yang, Santa Clara
University,
"Current Capacity of Carbon Nanofiber Interconnects".
|
|
|
Prof.
Scott Dunham, University
of Washington,
"Utilization of atomistic computations in process modeling".
|
|
|
|
|
2009
|
Prof.
Mark Lundstrom, Purdue
University, “Device Physics
of the Nanoscale MOSFET: An Introduction to Electronics from the Bottom Up”
|
|
|
Prof.
Eric Vogel, University of Texas at Dallas,
“Electrical Characterization of Advanced MOS Devices”
|
|
Workshop Sponsors
|
|
Boise Section
|
Boise Chapter
|
|
|
|
|
