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WMED Invited Speakers History
Since the inception of this workshop, we have been
able to bring in the leaders from the industry and academia as invited
speakers to provide insight into the state-of-the-art of technology related
to micro- and nono-electronics. In
recent years, we have been able to offer parallel tutorials at the workshop
to promote in-depth discussions on relevant topics.
Here is the list of past invited speakers at
WMED:
WMED INVITED
SPEAKERS AND TOPICS
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2002
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Prof.Hiroshi Iwai, Frontier, Tokyo Institute of Technology (Keynote)
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Eric Fossum, Micron Technology, Inc.
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Jake Baker, Boise
State University
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Sunit Tyagi, Intel Corporation
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Trung Doan, Micron Technology, Inc.
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2004
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Dr.Steven Hillenius, Agere Systems, "The Future of Silicon
Microelectronics" (Keynote)
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Dr.
H. Rhodes, Micron Technology, Inc., "CMOS Imager Technology Shrinks
and Image Performance"
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Dr.
Gary Bronner, IBM, "Scaling Trends in DRAM Technology"
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Prof.
Albert Wang, Illinois Institute of Technology, "A Review of RF ESD
Protection Design"
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Dr.
Carlos H. Diaz, TSMC, "CMOS Technology for MS/RF SoC"
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Prof.
Paul S. Ho, University of Texas, Austin,
"Packaging Effect on Reliability of Cu/low k Interconnects"
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Prof.
Junichi Murota, University
of Tohuku,
"Atomically Controlled Processing for Future Si-Based Devices"
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Dr.
Luan C. Tran, Micron Technology, Inc., "Beyond Nanoscale DRAM and
Flash - Challenges and Opportunities for Research in Emerging Memory
Devices"
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2005
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Prof.
Paul Yu, University of California, San
Diego, “Optoelectronic Devices for Wireless
Broadband Communications”
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Prof.
Ilesanmi Adesida, University
of Illinois, “GaN
Nanoelectronics: Promises and Prospects”
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Dr.
Gennadi Bersuker, Sematech, “High-K Gate Dielectrics”
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2006
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Al
Fazio, Intel Corporation, "Future Directions of Non-Volatile Memory
Technologies" (Keynote)
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Dennis
Hess; Georgia Tech, "Preserving Low-k Dielectrics During Photoresist
and Etch Residue Removal"
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Karl
Strauss, Flight Avionics Systems, Jet Propulsion Laboratory, "Lest We
Never Forget: A Historical Perspective of Space Data Recorders; A
Prediction for the Future"
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Neil
Goldsman; University of Maryland at College
Park, "Physics Based Modeling and Design of
Chips, Devices, and Nanostructures: Present and Future"
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2007
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Dr.
Hans Stork, Sr. VP & Chief Technology Officer, Texas Instruments, "Technology
Challenges for CMOS Density Scaling" (Keynote)
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Prof.
Jamal Deen, McMaster
University,
"Noise Issues in CMOS Devices and Circuits"
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Prof.
Juin J. Liou, University of
Central Florida,
"ESD Protection in CMOS Technology"
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Dr.
Prashant Majhi, SEMATECH/Intel - "CMOS Scaling Beyond High k-Metal
Gates: Opportunities and Challenges"
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Dr.
Nety Krishna, Applied Materials, "The Role of Equipment and New
Materials in Emerging Non-Volatile Memories"
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2008
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Dr.
Gurtej Sandhu, Micron Technology, Inc., "Trends, Challenges and
Opportunities in Semiconductor Memory Technology Scaling" (Keynote)
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Dr.
Krishna Parat, Intel Corporation, "NAND Flash Memory Scaling - Key Challenges
and Future Outlook".
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Prof.
Vivek Subramanian, Univ.
of California Berkeley,
"Printed electronics for low-cost tags and sensors"
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Dr.
Ken MacWilliams, Applied Materials , "Emergence of double patterning and
in particular self aligned double patterning for the 32nm half pitch and
below"
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Dr.
Hector De Los Santos,
CEO, Nano MEMS, "Nano MEMS and its Applications"
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2009
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Dr.
Vijay Kapur, President and CEO, International Solar Electric Technology,
Inc. “Commercialization of ‘Ink Based’ and Low Cost CIGS Solar
Cells/Modules” (Keynote)
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Dr.
Jeffrey Welser, Director, SRC Nanoelectronics Research Initiative, “The
Semiconductor Industry’s Nanoelectronics Research Initiative: Motivation
and Challenges”
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Dr.
Daniel C. Edelstein, IBM Fellow and Manager, IBM T.J.
Watson Research
Center,
“Integration/Reliability Issues for Cu/Low-k BEOL Interconnects”
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Prof.
Veena Misra, North Carolina
State University,
“Application of High-k Dielectrics in Memory, Power and Emerging
Technologies”
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INVITED
TUTORIAL SPEAKERS AND TOPICS
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2005
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Prof.
Jake Baker, Boise
State University,
“Design of High-Speed CMOS Op-Amps for Signal Processing”
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Dr.
Paul Dodd, Sandia National Laboratory, “Single-Event Effects in Scaled
Technologies: Getting Down to Earth with Radiation Effects”
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Dr.
Larry Moresco, DFX Solutions “Advanced Microelectronic Packaging: Materials
and Structures”
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2006
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Christopher
L. Henderson; President, Semitracks, Inc., "Current Reliability and
Failure Analysis Issues for High Volume Memory Products"
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Nozad
Karim; VP, App. Engrg. & Characterization, Amkor Technology, "3D
Memory Packaging Technologies & Trends"
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2007
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Dr.
Charlie Zhai, Advanced Micro Devices, "Stress Simulation of
Semiconductor Devices and Packaging"
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Dr.
Kenneth Goodson, Stanford
University
"Nanoscale Thermal Management for Advanced Integrated Circuits"
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Dr.
Hanmant Belgal, Intel/IM Flash Technologies, "Reliability of
Floating-Gate Flash Memories"
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2008
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Prof.
Cary Yang, Santa Clara
University,
"Current Capacity of Carbon Nanofiber Interconnects".
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Prof.
Scott Dunham, University
of Washington,
"Utilization of atomistic computations in process modeling".
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2009
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Prof.
Mark Lundstrom, Purdue
University, “Device Physics
of the Nanoscale MOSFET: An Introduction to Electronics from the Bottom Up”
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Prof.
Eric Vogel, University of Texas at Dallas,
“Electrical Characterization of Advanced MOS Devices”
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Workshop Sponsors
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Boise Section
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Boise Chapter
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