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WMED 2012 Technical Program
Friday, April 20, 2012 8:00AM-6:00PM
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8:00 AM
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Check In and Door Registration
With Continental Breakfast
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8:30 AM
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Welcome to WMED 2012
Room: Jordan D
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9:00 AM
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Keynote Address:
Prof. Rahul Sarpeshkar, Massachusetts Institute of Technology, Research Laboratory
of Electronics
Room: Jordan D
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10:00 AM
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Break and Poster Setup
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10:15 AM
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Invited Tutorials (Parallel sessions)
Tutorial 1: “Phase-Change Memory: Replacement
or Transformational”
Dr. Chung Lam, Distinguished Engineer, IBM, T.J. Watson Research Center
Room: Jordan D
Tutorial 2: “Practical Applications of Asynchronous Pipeline Circuits”
Brian Johnson, Distinguished Member of the Technical Staff,
Micron Technology, Inc.
Room: Jordan AB
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12:00 PM
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Buffet Luncheon
Provided by WMED
Room: Hatch Ballroom
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1:00 PM
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Invited Talk:
“Nano-Electro-Mechanical Memory Technology for Future Compact and
Ultra-Low-Power Integrated Systems”
Prof. Tsu-Jae King Liu, IEEE Fellow, UC Berkeley
Room: Jordan D
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1:45 PM
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Invited Talk:
“Nanophotonic Interconnection Networks for Performance-Energy Optimized Computing”
Prof. Keren Bergman, IEEE Fellow, Columbia University
Room: Jordan D
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2:30 PM
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Invited Talk:
“Emerging Magnetic Memories”
Dr. William Gallagher, Senior Manager, IBM, T.J. Watson Research Center
Room: Jordan D
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3:15 PM
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Break
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3:30 PM
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Contributed Papers (Parallel Sessions)
Session 1 Process and Devices
Room: Jordan D
Session 2 Solid State Circuits
Room: Jordan AB
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5:15 PM
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Poster Session and Refreshments
Room: Hatch Ballroom
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IEEE WMED 2012 Contributed Papers and Posters
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Session 1: Process and Devices
Room: Jordan D
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3:30 PM
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“A Novel Method to Address ILD CMP Non-uniformity Issue for Advanced Memory Device Integration”
W. Wei, I. McDaniel and A. Jindal, Micron Technology Inc.; J. H. Ng, Micron Semiconductor
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3:50 PM
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“Numerical Simulation of Heat Generation during the Back Grinding Process of Silicon Wafers”
A. H. Abdelnaby, G. P. Potirniche, F. Barlow and A. Elshabini, University of Idaho; S. Groothuis and R. Parker, Micron Technology, Inc.
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4:10 PM
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“Integration of Laser Control Technology with i-GLV to Directly Image High-Resolution Patterns for Advanced 3D Packaging”
H. Matsui, N. Kawamura and J. Snow, Dainippon Screen Mfg. Co., Ltd.
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4:30 PM
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“Analytical Model of Deeply-Scaled Thyristors for Memory Applications”
D. Ventrice, P. Fantini, D. Betto, G. Carnevale and A. Benvenuti, Micron Technology Inc.
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4:50 PM
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“Step Deposition and Stabilizer Interaction in Electroless Nickel Bath for Bond Pad Metallization”
C. Tiwari, R. Nguyen and Nick Phucas, Micron Technology, Inc.; B. B. Teo and T. Steneck, IM Flash Technology
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Session 2: Solid State Circuits
Room: Jordan AB
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3:30 PM
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“On-Chip 3D Inductors using Thru-Wafer Vias”
G. VanAckern, R. J. Baker, A. J. Moll and V. Saxena, Boise State University
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3:50 PM
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“An Algorithmic Study of DDR3 SDRAM On-Die Termination Switch Timings”
S.N. Wong, Micron Semiconductor
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4:10 PM
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“Multi-bit Continuous-Time Delta-Sigma Modulator for Audio Application”
R. Mohan, R. Koppula, S. Balagopal and V. Saxena, Boise State University
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4:30 PM
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“Two Techniques to Reduce Gain and Offset Errors in CMOS Image Sensors using Delta-Sigma Modulation”
K. Yap and R. J. Baker, Boise State University
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4:50 PM
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“High Voltage Tolerant Stacked MOSFET in a Buck Converter Application”
S. Page, A. Wajda and H. Hess, University of Idaho
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Poster Session and Refreshments
Room: Hatch
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“PMOS Device Performance Improvement by using Buried Contact Implants”
S. Qin, T. McDaniel, L. J. Liu, R. Burke, Y. J. Hu and A. McTeer, Micron Technology, Inc.
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“Deep Trench Patterning and Lift off Resist in Microfluidic Devices”
B. Pun, M. Mitkova and P. Miranda, Boise State University; R. Zoller and M. Seibert, pSiFlow Technology, Inc.
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5:15 PM
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“Nano-Ionic Conductive Bridge Memristors Based on Chalcogenide Glasses – Electrical Performance Characterization and Modeling”
M. R. Latif and M. Mitkova, Boise State University
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“Dependence of the Structure on Performance of Chalcogenide Glass Based Radiation Sensors”
M. S. Ailavajhala, P. Chen, M. Mitkova and D. P. Butt, Boise State University; D. Olesky, Y. G. Velo and H. Barnaby, Arizona State University
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“Flexible Photovoltaics”
P. Salvador, M. Ostyn and S. Parke, Northwest Nazarene University
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“Measurement and Simulation of Hysteresis in LTCC Electron Hop Funnel IV Curves”
T. Rowe, M. Pearlman and J. Browning, Boise State University
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This workshop is receiving technical co-sponsorship support from the IEEE
Electron Devices Society.
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