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Invited Tutorial - MEMS: Driving Advances in Electronic Devices

Steve Groothuis, Micron Technology, Incorporated

Abstract:

The goal of the course is to give you a brief overview of MEMS technologies by covering packaging, reliability, simulation, and testing. We will venture into recent developments like Sensor Fusion, Integrated CMOS-MEMS, and BioMEMS. You will gain an in-depth knowledge of challenges and opportunities associated with bringing MEMS-based products to market through the course's focus on two key topics:

• MEMS Packaging - You will learn packaging concepts for MEMS devices while reviewing assembly and packaging procedures such as structural release, cleaning, encapsulation, and testing. The tutorial will also cover various challenges associated with packaging and testing MEMS.
• MEMS Reliability – This tutorial will review MEMS reliability issues and associated analysis/simulation techniques. MEMS reliability requires a broad understanding of physics, material science, and mechanics in order to handle the challenges during research, development, and productization.

Speaker’s biography:

Steve Groothuis joined Micron in 2000 as a Senior Packaging Engineer in Micron’s Assembly Department while working at Micron’s Texas Engineering Center (MTEC) in Allen, TX. In 2005, he joined Micron’s Device Technology Group in Boise as a Senior Device Engineer and became the Technology CAD section manager in 2007. Currently, he is a Micron SMTS and the Thermal Mechanical Analysis Group (TMAG) leader in Micron’s Device Technology Group within the Process R&D department. Steve and his team are instrumental in simulating effects in memory package development, implementing Design for Manufacturability (DFM) for fab processes, and modeling wafer-level mechanics & physics. As an external activity, Steve has been involved in the development of several three-axis accelerometers & gyroscope devices, consulting for a few MEMS packaging initiatives, and providing technical support of some BioMEMS technology projects.

This workshop is receiving technical co-sponsorship support from the IEEE Electron Devices Society.

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