Session 1: Process and Devices
Room: Jordan D

3:30 PM

“Flash Memory Scaling: Challenges and Opportunities”
R. Koval, Intel Corporation – (Invited Paper)

4:00 PM

“PECVD of GexS1-x Films for Nano-Ionic Redox Conductive Bridge Memristive Switch Memory”
M. R. Latif, M. Mitkova, G. Tompa, and E. Coleman, Boise State University

4:20 PM

“Thermal Processing Impact on the Integrity of HfO2-Based High-k Gate Dielectrics”
X. Lin, W. Morinville, Z. Suo, K. Zhuang, C. Krasinski, D. Markowitz, K. Noehring, Y. Zhou, S. York, H. Yapa, J. Brown, and S. Lu, Micron Technology, Incorporated

4:40 PM

“Numerical Simulation of Silicon Wafer Warpage Due to Thin Film Residual Stresses”
A. H. Abdelnaby, G. P. Potirniche, F. Barlow, and A. Elshabini, University of Idaho; S. Groothuis and R. Parker, Micron Technology, Inc.

5:00 PM

“Three-Dimensional FinFET Simulation using the FDTD Method”
D. M. Sullivan, University of Idaho

Session 2: Circuits and Systems
Room: Jordan BC

3:30 PM

“FinFET Variability and its Impact on Digital and Analog Circuits”
V. Moroz, Synopsys Corporation – (Invited Paper)

4:00 PM

“Systematic Design of 10-bit, 50MS/s Pipelined ADC”
K. Zhu, S. Balagopal, and V. Saxena, Boise State University

4:20 PM

“A New Method for Causality Enforcement of DRAM Package Models using Discrete Hilbert Transforms”
H. Aboutaleb, L. L. Barannyk, A. Elshabini, and F. Barlow, University of Idaho

4:40 PM

“A Multi-Synchronous UART Design”
D. Bhadra, V. S. Vij, and K. S. Stevens, University of Utah

5:00 PM

“Low Power, High Gain CMOS Op Amps”
K. Cahill, D. J. Comer, Brigham Young University; K. Layton, ON Semiconductor

Micron Research Symposium
Room: Hatch AB

3:30 PM

An Industry Perspective on University Research
J. Thomas Pawlowski, Fellow and Chief Technologist, Micron Technology, Incorporated

4:00 PM

“Comparison of Passive Enforcement Techniques for DRAM Package Models”
D. Elgamel, L. Barannyk, A. Elshabini, and F. Barlow, University of Idaho

4:20 PM

“Deep Sub-Wavelength Optical Nanolithography: Going Beyond the Far-Field Diffraction Limit”
R. Menon, University of Utah

4:40 PM

“DMR3D: Dynamic Memory Relocation in 3D Multicore Systems”
D. M. Ancajas, K. Chakraborty, and S. Roy, Utah State University

5:00 PM

“CMOS Analog High-Frequency Circuits for Emerging Applications”
J. C. Rudell and V. Bhagavatula, University of Washington

Poster Session and Refreshments
Room: Simplot AC
Time: 5:30 pm

“Pixel Structures for Energy Harvesting Image Sensors”
I. Cevik and S. U. Ay, University of Idaho

“Level Shifter for Triggering of High Voltage MOSFET Stack”
A. Wajda, L. R. Kitzko, and R. Riggs, University of Idaho

“Design, Fabrication, and Performance of a Bidirectional DC/DC Converter using Capacitive Triggering of High Voltage MOSFET Stack”
R. Riggs, L. R. Litzko, and S. Page, University of Idaho

“Machine Vision System for Agricultural Applications”
P. Salvador, M. Horton, and D. M. Bulanon, Northwest Nazarene University

“Catalyst Assisted Photodecomposition of Organic Contaminants in Aqueous Environments”
D. S. Stout, A. W. Rusch, K. A. Nogales, K. Goettsche, and J. D. Harris, Northwest Nazarene University; W. B. Knowlton, A. Thurber, and A. Punnoose, Boise State University; S. M. Hubbard, Rochester Institute of Technology

“RockSAT-X: Evaluating Future Space Technology”
S. Jeija, B. Gordon, D. Vinson, D. Johnson, Z. Thomas, S. Parke, and D. Lawrence, Northwest Nazarene University

“3D Modeling of Microelectronic Structures in R&D”
A. Gruszka and J. Jozwiak,Micron Technology, Incorporated

“Scanning Frequency Comb Microscopy: A New Method for Sub-nm 3-D Dopant Profiling”
M. J. Hagmann,NewPath Research L.L.C; D. A. Yarotski, Los Alamos National Laboratory