Tuesday, November 23rd, 2010
Western Digital, 1710 Automation Parkway, San Jose, CA
Directions and Map
Cookies, Conversation &
Pizza too at 7:00 P.M.
Presentation at 7:30 P.M.
Recent Advances and Market Position of Spin-Torque MRAM
Dr. Rajiv Ranjan
Avalanche Technology
Abstract
New product applications have an increasing demand for a non-volatile memory (NVM) exhibiting higher speeds, extended endurance and lower power consumption as existing solutions are not fully capable to deliver on all of these attributes. Of the group of new NVMs, Phase-change RAM (PRAM), Field-switching MRAM (Field-MRAM), Resistive RAM (RRAM) and Spin-torque based MRAM (STT-MRAM), STT-MRAM has the most attractive combination of fast read and write speed (<50ns) and high endurance (>1013) along with non-volatility.
Recent progress on spin-torque MRAM at both MTJ cell-level as well as CMOS-integrated chip levels will be reviewed. The key technical and manufacturing challenges associated with this technology will be discussed. In the technical area, the key focus area is switching current (or voltage) reduction at short pulse width (<10ns) while maintaining high magnetic bit thermal stability. Results from MTJs with novel free-layer structure achieving low-switching current while maintaining high thermal stability will be presented. In the manufacturing area, the key integration and processing issues will be highlighted.
Finally, the market positioning of the spin-torque MRAM is discussed. While it is currently being targeted for stand-alone commodity memory (replacing DRAM and flash) as well as embedded memory (replacing embedded Flash in MCU and embedded SRAM and DRAM ), new market applications such as solid state drives and embedded solutions in advanced System-on-Chips (SoCs) are also being explored. We will compare the key value add from STT-MRAM in these market segments.
|