PPT Slide

c

NHI/YMMT/0002/00

NTT 1996

P

in bottlenecks in board-to-board data transmission

Required data throughput between circuit boards in future connection-intensive

switching systems:

:

540 Gbit/s

[MCM(8

x

4), each chip fabricated by 0.25-?m process]

Data throughput between circuits boards in conventional plug-in units

(Hi-PAS standard developed by NTT)

Case1

Case2

Case3

Number of connectors: 6

(26-pin electrical)

Throughput: 156 Mbit/s

x 26 x 6=

24.3 Gbit/s

Number of connectors: 18

(16-pin electrical)

Throughput: 156 Mbit/s

x 16 x 18=

44.9 Gbit/s

Number of connectors: 6

(8-pin MU-type optical)

Throughput: 2.4 Gbit/s

x 8 x 6=

115.2

Gbit/s

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