Key Differences between EU RoHS and China RoHS
Dr John H. Lau
Are You Really Ready for RoHS and WEEE?- A Course on Tin Whiskers and Flame Retardants
Prof. Michael Pecht
High Performance Signal and Power Integrity Design for Complex PCB and IC Package
Dr. Wang Tong
Packaging and Board Assembly: Technology Trend, Materials, Processes and Reliability
Dr. Dongkai Shangguan
Polymers for Electronics and Photonic Packaging: Materials, Process and Reliability
Prof. C P Wong
Impacts of EU RoHS & China RoHS on Design, Materials, Process, Manufacturing, and Reliability of Electronics Products
Dr John Lau
Trend and Design of MEMS & Advanced Packaging
Dr Kuo-Ning Chiang
Preparation and Implementation for Lead-Free Soldering
Dr Ning-Cheng Lee
Conductive Adhesive Joining Technology for Electronics Packaging Applications
Professor Liu Johan
Migration to Lead-Free Microelectronic Assembly Some Key Technical Issues
Dr Karl Puttlitz
Trends in High Density Packaging and Portable Microelectronics
Ms E Jan Vardaman
Impact of Lead-Free on Electronic Optoelectronic Packaging and Their SMT Assembly
Dr John H. Lau
Monitoring the Health (Reliability) of Products
Prof Michael Pecht
Wire Bonding in Microelectronics
Mr George G. Harman
Three Dimensional Packaging, Interconnection & Assembly for Microelectronics Miniaturization
Dr. Chuck Bauer
15 Apr 02
Electronic Packaging Orientation
Dr. Ricky Lee
Ivan Sham
Ben Lui
Tsui Yat Kit
9 Apr 02
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Thermal Management of Electronic
Components
Dr. Cohen
Wirebonding
