Announcing the joint
International, ASME/IEEE/IMAPS Workshop
MECHANICAL RELIABILITY OF POLYMERIC MATERIALS
AND PLASTIC PACKAGES OF IC DEVICES
Sponsored by the Electrical & Electronic Packaging Division, ASME International in collaboration with the IEEE Components, Packaging and Manufacturing Technology Society and International Microelectronics and Packaging Society
Paris, November 29 to December 3, 1998
Hotel Concorde Saint-Lazare, 108 rue Saint-Lazare-75008,
(33)(1)40.08.44.44, fax (33)(1)42.93.01.20
Call for Papers
WORKSHOP Polymeric materials are widely used in microelectronics and photonics. Examples are: plastic packages of integrated circuit devices, adhesives, various enclosures and plastic parts, polymeric coatings of optical silica fibers, and even polymeric lightwave guides. Polymeric materials are inexpensive and lend themselves easily to processing and mass
production techniques. The reliability of these materials, however, is usually not as high as the reliability of inorganic materials and is often insufficient for particular applications, thereby limiting the area of the technical use of polymers.
The goal of the workshop is to address the state-of-the-art knowledge in the field of mechanics and the reliability physics of polymers employed in microelectronics and photonics, including various aspects of their mechanical behavior, short- and long-term performance, thermal and viscoelastic properties, fracture toughness, moisture sensitivity, aging, adhesive strength, stress concentration effects, role of fillers, interfacial phenomena, response to dynamic and thermal loading, stability of manufacturing processes that involve making of plastic parts and packages, etc. We intend also to address various reliability problems associated with manufacturing, testing, reflow-soldering and operation of plastic electronic packages.

AUDIENCE We intend to bring together mechanical, electrical, optical, reliability, industrial and manufacturing engineers; materials scientists, applied physicists and chemists, to discuss and advance experimental and theoretical techniques and approaches aimed at the prediction and improvement of the short- and long-term performance of polymeric materials
for the applications in questions, with an emphasis on plastic packages of IC devices.
INVITED SPEAKERS The partial list of invited speakers and international liaisons includes: R.Wyndrum (AT&T), L..M.Keer (Northwestern Univ.),S. Matsuoka(Brooklyn Poly), L. Shepherd, L.T. Manzione (Lucent), R. Tummala, C.P.Wong (Georgia Tech), M.Pecht (Univ.of Maryland), A. Bar-Cohen (Univ. of Minnesota), L. Feinstein (Allegro Microsystems), B. Michel (Fraunhofer Institute, Germany),E. Zakel (PacTech, Germany), A. Chudnovsky (U. of Illinois), J. W. Idol (Rutgers), A. O. Tay (National Univ. of Singapore), Y-H. Pao (Ford Motor Co), D.W. Whalley (Loughborough Univ., UK), P.Mach (Technical Univ., Chech Republic).

ABSTRACTS SUBMISSION Prospective authors should submit a 400-word abstract (your complete business address, phone, fax and e-mail numbers must be included) no later than April 1, 1998 to: Dr. Ephraim Suhir, General Chair, Bell Laboratories, Lucent Technologies, 600 Mountain Ave., Room 1D-443, Murray Hill, NJ 07974, USA
908-582-5301, fax 908-582-5106, e-mail: suhir@lucent.com
DEADLINES
Electronic and Hard Copy Submission of Paper Abstract: April 1, 1998
Author Notifications of Abstract Acceptance: May 1, 1998
Full Paper Submission: July 1, 1998
Acceptance Notification: August 1, 1998
Revised Paper Submission: September 1, 1998
Visit the ASME web site for future announcements and updates regarding the ASME/IEEE/IMAPS Workshop, as well as the guidelines for abstract submission at https://www.asme.org/conf/POLY98/index.htm or contact: Brian Bigalke, Meetings & Conferences, ASME International Ph: 212.705.7057 / Fx: 212.705.7856 / Email: bigalkeb@asme.org