CALL FOR PAPERS
FOR A SESSION ON
ACCELERATED PRODUCT QUALIFICATION
InterPack '99
The Pacific Rim/ASME International, Intersociety
Electronic Packaging Conference
Westin Maui Kaanapali Beach Hotel
Lahaina, Hawaii, USA
June 13-19, 1999
You are invited to submit a paper for presentation at InterPack'99, to be held in Hawaii, June 13-19, 1999. InterPack is sponsored by ASME International and is intended as a forum for dissemination of information related to the field of Electronic and Photonic Packaging.
The objectives of the conference are to foster international
cooperation, understanding and promotion of efforts in
Microelectronics, Optoelectronics, and Photonics Packaging Engineering in an East/West business setting.
The Accelerated Product Qualification track invites papers that report on aspects of accelerated testing that include and not limited to: state-of-the-art in accelerated testing, complex stress environments, stress interaction in combined stress testing, state-of-the-art test hardware and software, predictive failure models and mechanisms, computer modeling and simulation, field to test correlation, role of material characterization, role of failure analysis, statistical issues in determining sample sizes, and quantitative estimate of field reliability from testing. Overall, the session is intended to provide a broad coverage of the state-of-the-art in accelerated testing, physics, and modeling techniques.
Prospective authors should submit an abstract of approximately 200 words in length with name, title, company, address, phone, fax and email to one of the following:
**Rakesh Agarwal
email: ragarwal@mail.delcoelect.com
Ph. : 765-451-7361, Fax: 765-451-9874
Delphi Automotive Systems, One Corporate Center, MS R103, Kokomo, IN 46904-9005.
**Abhijit Dasgupta
email: dasgupta@eng.umd.edu
Ph.: 301-405-5251, Fax: 301-314-9477/9269
CALCE EPRC, Mechanical Engineering, University of Maryland, College Park, MD 20742
**Mark Gibbel
email: Mark.Gibbel@jpl.nasa.gov
Ph.: 818-542-6985/6979, Fax: 818 249-5714
November 27, 1998 Three copies of a 200 to 300 word abstract. (Late abstracts may be considered)
February 1, 1999 Author notification of paper acceptance
For additional information about the Accelerated Product Qualification track sessions contact us or look up the following web sites:
https://members.aol.com/intpak99/intpak99.htm or https://www.asme.org.
CPMT Annual Report to TAB
The Components, Packaging and Manufacturing Society grew in depth and breadth in 1998 with a renewed focus on the needs of members, Chapters and the industry.

- Focused recruitment efforts, including a new membership brochure, resulted in a membership increase of approximately 4% over 1997.
- Two new Chapters were formed (Finland and Hong Kong) and new programs were implemented to support Chapter activity, including a subsidy program and Chapter of the Year Award. For the third straight year, the Society supported and participated in the Divisions I and IV Region 8 Chapters
Meeting.
- A major effort was undertaken to ensure that the Society continues to address leading-edge technologies. Existing Technical Committees were strategically evaluated and restructured, and 5 new Committees were created for a total of 19.
- The 3 Society Transactions continued to feature the latest technology developments with Special Sections on electrical contacts, polymeric materials, thermal investigations and 3D packaging.
- Over 20 conferences and technical meetings were sponsored, cosponsored or otherwise supported by the CPMT Society and showed strong attendance.
- A partnership was undertaken with Georgia Tech and the National Science Foundation to support the development of packaging education programs that address the needs of industry in the 21st century.
--submitted by President John Stafford

NOMINATIONS SOLICITED FOR CPMT SOCIETY AWARDS
Nominations are now being solicited for 1999 CPMT Society Awards. If you feel that you or a colleague qualifies, consider taking the time submit a nomination.
1. David Feldman Outstanding Contribution Award: To recognize an outstanding contribution to the fields encompassed by the CPMT Society through invention, technical development or executive or managerial directions.
Prize: $1,000 and Certificate
Basis for Judging: Contributions to the organization or enterprises connected with the field; patent invention; contributions to CPMT Chapter, Section or Board of Governors activities; contribution to scientific or engineering basis of CPMT technology.
Eligibility: Recipient must have been a member of IEEE and CPMT for at least five years.
2. Outstanding Sustained Technical Contributions Award: to recognize outstanding sustained and continuing contributions to the technology in fields encompassed by the CPMT Society.
Prize: $1,000 and Certificate
Basis for Judging: Technical contributions must be sustained and continuing over a period of at least five (5) and preferably 10 years. One major contribution will not qualify. Must be documented by open literature publications such as papers, patents, books and reports (available to the public).
Eligibility: Must have been a member of the IEEE and CPMT Society for at least three (3) years.
3. Electronics Manufacturing Technology Award: to recognize major contributions to Electronic Manufacturing Technology in fields encompassed by the CPMT Society.
Prize: $1000 and Certificate
Basis for Judging: Contributions may include technical development of, or management (directing) of major new electronic manufacturing processes; significantly increasing yield and/or reliability of established manufacturing processes, etc. Work in the management of CPMT conferences or its BoG may be contributory but not sufficient to receive the award.
4. Outstanding Young Engineer Award: To recognize outstanding contributions to the fields encompassed by the CPMT Society through invention, technical development, publications, or new product implementation.
Prize: $500 and Certificate plus one year free membership in CPMT with all CPMT Transactions.
Basis of Judging: Technical contributions through patent invention, contributions to technology or product development within the CPMT Field of Interest. May encompass
management (directing) of significant new product introduction or implementation of major new electronic manufacturing processes; significantly increasing yield and/or reliability of established manufacturing processes. Contributions to the Society, through the BoG, Conferences, Chapters, etc., will also be considered. Proof of contributions may consist of open literature publications (preferred) such as papers, patents, books, and reports (available to the public). At least three (3) letters from peers and management at the nominee's place of employment attesting to the accomplishment(s) can be accepted in lieu of publications.
Eligibility: Must have been a member of the IEEE (member grade or above) for at least three (3) years, and must be less than 35 years of age at the time of nomination.
Guidelines for Nominators:
Past recipients of an award are not eligible to receive that same award. For list of past awardees, see the CPMT Society Home page (https://www.cpmt.org/awards.html).
An individual may submit only one nomination per award but may submit nominations for more than one award.
It is the responsibility of the nominator to provide quality documentation to assist the Awards Committee in evaluating the candidate. Please refer to the Basis of Judging for each award. Although not required, letters of endorsement may be provided.
Please send nominations to CPMT Society Awards Committee Chair by e-mail, fax or mail:
Rao Bonda, Motorola, Inc.
2100 East Elliot Road,
Mail Drop: EL606
Tempe, AZ 85284
Phone: (602)413-6121, Fax: (602)413-4526/3608
Email address: r.bonda@ieee.org
Nominations must be received by 8 January 1999. Winners will be notified by 15 February 1999. Awards will be presented at the 1999 Electronic Components and Technology Conference unless an alternate venue is selected by the winner.