International Symposium on Electronic Materials and Packaging 2000
(EMAP2000)
November 30 - December 2, 2000
Hong Kong University of Science & Technology,

Clear Water Bay, Hong Kong

Call For Papers and Participation

You are invited to submit a paper for the EMAP2000. The EMAP2000 symposium is organized by the Hong Kong University of Science & Technology in collaboration with Nanyang Technological University, Singapore and the City University of Hong Kong. It is jointly sponsored by the IEEE Component, Packaging and Manufacturing Technology (CPMT) Hong Kong Chapter, the ASME Hong Kong Section, Croucher Foundation and the Institute of Materials Research & Engineering (IMRE), Singapore. The objective of this symposium is to create an international forum for the exchange, dissemination and discussion of state-of-the-art technologies and recent developments in electronic materials, packaging and assembly. Following the tremendous success in the first conference in Singapore, which was attended by delegates from 10 major countries, the second symposium will be held in Hong Kong, the Pearl of the Orient. It will be the first major conference on electronic materials and packaging ever to be held in this city. Meet world-renowned authorities from the Asia-Pacific region, USA and Europe. Join us and get in touch with leading-edge technologies, and find out more about Hong Kong’s and South China’s electronic packaging industries. In addition, short courses on current packaging trends and technological issues will be offered. Papers are invited from industry participants as well as researchers from the academia and government organizations.

Major Topics of Symposium
**Advanced Electronic Packaging Technologies: Wafer Level Packaging, FC, CSP, DCA, MCM
**Packaging Materials and Processes: Lead-free Solders, Adhesives, Underfills, Encapsulants, PCBs
**Interconnect Technologies: Wirebonding, Fine Pitch, Microvia, Build-up Technologies
**Materials Characterisation, Testing and Measurements: Electrical, Thermal, Chemical, Mechanical
**Package Design, Modeling and Simulation
**Reliability and Failure Analysis: Interfacial Phenomena, Delamination, Moisture effects

**MEMS Packaging
**Polymers and Ceramics for Electronic Applications,Thin films/coatings, Metallization

 

Abstracts and Papers

A one-page abstract should be submitted to the Secretariat of Symposium, describing the scope, contents and key points of the proposed paper. Instructions for preparing the full paper will be sent to the authors whose abstracts are accepted after review. Participants will be required to register upon notification of accepatance of their full papers. The registration fee is US$350 before October 15, 2000, or US$380 if paid afterwards. Reduced fees are applicable for students and bulk registrations (more than ten) from the same institution/company. The registration fee will cover the abstract book, lunches, morning and afternoon refreshments, a reception and a banquet. Exhibitions will be arranged and the details will be announced later.

Executive Committee
Chair: MMF Yuen (HKUST)
Members: PCH Chan (HKUST), YC Chan (CityU), WT Chen (IMRE, Singapore), SL Law (HKPC), P Tong (HKUST), CY Yue (NTU, Singapore)

Industrial Advisory Board
Chee Cheung (Compass Tech), Ken Cheung (ASM); Terry L.K. Cheung (ElecEltek); Kelvin Chow (Alpha Fry Tech), T.L. Ho (Motorola); Z Karim (Shipley Ronal); Clement Lee (Dexter Hysol); Steve H.K. Lee (Advanced Analogic Technologies); Kenneth K.H. Lee (Cookson-Alphametal); Peter C.K. Liu (ASM); Neil Mclellan (ASAT); Ignatius J. Rasiah (Allied Signal); Ben Robinson (Astron Adv Tech); S.W. Woo (Hana); Graham Young (Henkel/Loctite)

Organizing Committee
Co-Chairs: JK Kim, AnnetteT Cheung,
Ricky SW Lee (HKUST)
Secretary: C Ho, E Ho (HKUST)
Members: Thomas Chow (HKPC), DCC Lam (HKUST), KY Sze (HKU), SP Wong (CUHK), JS Wu (HKUST), Lawrence Wu (CityU), KC Yung (PolyU)

International Advisory Board
Hans-Jurgen Albrecht (Siemens)
Rolf Aschenbrenner (IZM)
WH Chen (Tsing Hua University)
KS Chian (Nanyang Tech Univ)
Y.Y. Earmme (KAIST)
Yoshitaka Fukuoka (Toshiba)
Kozo Ikegami (Tokyo Inst of Tech)
Y.I. Kim (LG Electronics)
John H. Lau (EPS)
J.H. Lee (DaeDuck Electronics)
Li-Chung Lee (MRL/ITRI)
T.B. Lim (Inst of Micro elctronics)
K-L. Lin (Cheng Kung University)
Fa Liu (CEPREI)
Johan Liu (Chalmers Univ of Tech)
JS Ma (Tsing Hua University)
B. Michel (IZM)
Shogo Mizumoto (IBM Japan)
W Nakayama (Therm Tech Intern)
LT Nguyen (Nat’l Semiconductor)
KY Park (Samsung Elec-mech)
MG Pecht (Univ of Maryland)
Ephraim Suhir (Lucent Tech)
AAO Tay (Nat Univ of Singapore)
DC Whalley (Loughborough Univ)
CP Wong (Georgia Inst of Tech)
Enboa Wu (ERSO/ITRI)
LQ Xu (DaimlerBenz-Chrysler )
S Yi (Nanyang Tech Univ)
Xiangfu Zong (Fudan University)

Important Dates
July 31, 2000 Abstract submission
August 15, 2000 Notice of abstract acceptance
September 30, 2000 Full manuscript submission
October 15, 2000 Registration/hotel accommodation

Correspondence:
Secretariat of EMAP2000
Department of Mechanical Engineering
Hong Kong University of Science & Technology
Clear Water Bay, Kowloon, Hong Kong
Tel: 852-2358 7184; Fax: 852-2358 1543; Email: emap@ust.hk
Home page: https://www.ust.hk/emap2000