"Call for Papers"!!
InterPACK '01®
https://www.asme.org/conf/ipack01/
The PACIFIC RIM / ASME International, Electronic Packaging Technical Conference & Exhibition
"An International Exchange Forum of State-of-the-Art Knowledge in Research, Development, Manufacturing, and Application of Packaging of Microelectronics, Photonics, and Microwave and Microelectromechanical Systems."

Hyatt Regency Kauai, Kauai, Hawaii, USA

July 8-13, 2001

(abstract submission by July 20 for early acceptance or by November 20, 2000)

Sponsored by:
The American Society of Mechanical Engineers (ASME International)
Co-sponsored by:
The Institute of Electrical & Electronic Engineers (IEEE) and The Japan Society of Mechanical Engineers (JSME);

CONFERENCE OBJECTIVES
International cooperation, understanding and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectro-mechanical Systems Packaging Engineering. Dissemination of knowledge by presenting research results, new developments, and novel thermal/mechanical/electrical packaging product concepts in Electronic Packaging Engineering will serve as the foundation upon which the conference program will be developed.

KEYNOTE SPEAKERS /Topics
William Kennard, Chairman, Federal Communications Commission, "The New Digital Economy"
Manabu Bonkohara, Director, Association of Super-Advanced Electronic Technologies, "Consortium Activity for System Integration in Japan."
Paul Meche, Principal Scientist, Nokia Mobile Phone, "Engineering Challenges of Telecommunications in the Next Decade"
Vijay Lund, Vice President, Server Technology Development, IBM Corporation, "Future Directions of High End Computing"
Jeffry J. Sniegowski, Distinguished Member of Technical Staff, Sandia National Laboratories, "MEMS: A New Packaging Challenge "

CONFERENCE PLANNING COMMITTEE MEMBERS
General Chair: Prof. Y. C. Lee, University of Colorado; Co-chair: Prof. Kikuo Kishimoto, Tokyo Institute of Technology;
Conference Program Chair: Dr. Donald Price, Raytheon Electronic Systems

Advisory Committee: President Hiroyuki Abé, Tohoku University; Dr. Dereje Agonafer, Univ. of Texas; Professor Avram Bar-Cohen, University of Minnesota; Dr. William T. Chen, National University of Singapore; Professor Wataru Nakayama, Japan; Professor Masumi Saka, Tohoku University; Professor Masaki Shiratori, Yokohama National University; and Dr. Ephraim Suhir, Lucent Technologies.
International Liasons: Prof. Carlos Altemani (Brazil); Prof. Adam Skorek (Canada); Prof. Yuqin Gu and Ricky S. W. Lee (China); Dr. Bernard Courtois (France); Dr. Rolf Aschenbrenner (Germany); Prof. Soon-Bok Lee and Kyung W. Paik (Korea); Prof. Andrew A. O. Tay and John Pang (Singapore); Prof. Andrew Y. H. Hung (Taiwan); Dr. David Whalley (United Kingdom); and Dr. Johan Liu (Sweden).

TOPICAL TRACKS
Technical session topics will focus on all areas of packaging and interconnects of microelectronics, photonics, microwave and micro-electromechanical systems including…

Reliability Packaging Technologies Microelectronic Systems
Thermal Management Electrical Design, Simulation and Test Photonics
Modeling and Characterization Manufacturing RF Microwave
Materials and Processes Exploratory Topics MEMS
Education Telecommunication

The abstract submission, review and notification will be conducted using WWW and e-mails. In addition, we will report other activities such as registration fee reduction, student travel support and Internet-based knowledge/technology exchange activities on the web at https://www.asme.org/conf/ipack01/

IMPORTANT DATES:
Paper Submission Deadline September 5, 2000
Acceptance Notification October 19, 2000
Final Camera-Ready Paper December 3, 2000