Call for Papers
ISEPT'2001
August 22-26, 2001
Beijing, China
Sponsored by
China Academy of Electronics and Information Technology and IEEE / CPMT Society

Supported by
Ministry of Information Industry of P.R. China
China Association for Science and Technology
National Natural Science Foundation of P.R.China
State Education Commission of P.R.China

The Fourth International Symposium on
Electronic Packaging Technology

The Fourth International Symposium on Electronic Packaging Technology as a sequel to ISMPPCBT'94, ISEPT'96 and ISEPT'98, which is now announced to be held in Beijing International Convention Center in Beijing, China. In this symposium, new advances in packaging materials, design and simulations, fabrication, reliability, and thermal management are discussed along with applications in different industries such as computer, communications, automotive, commercial electronics, etc. The conference will focus on the challenges and opportunities in microelectronics packaging for the 21st century.

The topics of interest will include, but are not limited to:
·Overview of electronic packaging trends & advanced packaging technologies
·Packaging design, modeling & simulation
·Manufacturing technologies
·Packaging materials and components
·Packaging processes: wiring, attaching,
bonding, soldering, sealing & encapsulation
·Material characterization: electrical,
chemical, mechanical & thermal management
·Reliability and testing
·Interconnection technologies
·Market and applications
·MEMS
·Others concerned

Call for Papers
The ISEPT'2001 program committee cordially invites interested authors to submit original papers dealing with all aspects of electronic packaging. Abstracts about 300 words in length should be submitted before Jan. 22, 2000. Please include the names of authors, affiliation, address, telephone, fax number, and e-mail address.

Technical tours
Technical tours to Tsinghua University, local institutes and factories are planned.
Exhibitions & Workshop
Exhibitions will be arranged. New microelectronics packaging technology and its related parts, materials, devices, and equipment will be displayed at the exhibition. Workshop will be held during the conference. Some famous professors will give lectures.
The details of the exhibitions and workshop will be announced later.

Sightseeing Tours
Tour for Beijing to the Great Wall or Summer Palace and Forbidden City will be planed for participants and their accompanying persons during the conference. A program for accompanying persons has also been arranged. Four optional post-conference tours in China are planned. Details are shown:
1.Xian 4days US$800 2.Guilin 4days US$800
3.Dunhuang 4days US$800 4.Three Gorge 4days US$800
* Tours and prices of the travel service subject to change, we will give the certain prices at Final Announcement.

Conference Language English

Registration
Registration fee is US$450 per delegate if pre-register before June 22, 2001 or US$500 otherwise.
Passport and Visa
Upon receiving your registration form, the conference secretariat will send you an official invitation letter. Please apply for visa with the letter at your local or nearest Chinese Embassy or Consulate.
Method of Payment
Bank: Banking Department, Head Office, Bank of China User: Tsinghua University
Account number: 00047108094001, Use for: ISEPT'2001, to School of Materials Science & Engineering, Tsinghua University, Professor Jusheng Ma.
You may pay at the conference registration desk, in this case, only travelers' cheque or cash are expected.

Conference Chairman
Keyun Bi (China Academy of Electronics & Information Technology)
Co-chairmen
Gong ke (Tsinghua Univ.)
Sheng Liu (Wayne State Univ., USA)
International Advisory
Committee
Chairmen
Hengde Li (Tsinghua Univ.)
R. R.Tummala (Georgia
Institute of Technology, USA)
Members
Bingkun Zhou (NSFC)
Chunguang Liang (Hebei Semi. Research Institute,China)
C. P. Wong (Georgia Institute of Technology, USA)
Charles E.Bauer (TechLead Corporation, USA)
Hongkun Liu (Ministry of Information Industry, China)
Juyan Xu (Hua-jing Electronics Group Corp., China)
Junwu Liang(Institute of semiconductor, China Academy of Science)
John H. Lau (Express Packaging Systems Inc., USA)
Minzheng Zheng (Ministry of Information Industry, China)
M. G. Pecht (Univ. of Maryland at College Park, USA)
M.F.Yuen (The H.K. Univ. of Science & Technology)
Tadatomo SUGA (The University of Tokyo)
W. Kinzy Jones (Florida International Univ., USA)
Xiangfu Zong (Fudan Univ.)
Y.C.Chen (City Univ. of H.K.)
Zhijian Li (Tsinghua Univ.)
YangyuanWang (Peking Univ.)
Organizing Committee
Chairman
Youbin Li (China Academy of Electronics & Information Technology)
Co-chairmen
Jusheng Ma (Tsinghua Univ.)
Xiang Wu (China Academy of Electronics & Information Technology)
Members
Chuck Bauer (Colorado, USA)
Chao-pin Yeh (Motorola, USA)
Deyou Wang (Institute of No.15, M.I.I., China)
Guoqi Zhang (Philips Inc.)
Jiang Jin (Hua-jing Electronics Group Corp., China)
Mingxin Ye (Fudan Univ.)
Mingda Shi (Fujitsu Nangtong Microelectronics Co.Ltd.)
Peixin Qian (Tsinghua Univ.)
Shi-Wei Ricky Lee (HKUST)
Wei Koh (Motorola, USA)
Xiaotian Xu (Ministry of Information Industry, China)
Yifan Guo (Motorola, USA)
Yi-Hsin Pao (Ford Research Lab., USA)
Zhengping Zhao (Hebei Semi. Research Institute, China)

Program Committee
Chairman
Shouwen Yu (Tsinghua Univ.)
Co-chairmen
Shangtong Gao (Hebei Semi.
Res. Inst., China)
Songliang Jia (Tsinghua Univ.)
Members
Chunfa Li (Minghang Electronic Components Co.)
Chuanming Zhou (Xiamen Yonghong Electronic Co.)
Dahe Huang (Institute of No.44, M.I.I., China)
Guohua Zhang (Institute of No.13, M.I.I., China)
Hongyu Zheng (Institute of No.13, M.I.I., China )
Houbang Wang (Institute of No.55, M.I.I., China)
Jinan Tang (Yixing Electronic Component Co.)
Jing Lin (Fudan Univ.)
Qi Zhang (Institute of No.43, M.I.I., China)
Weiyuan Xu (Institute of Electronics, China Academy of Science,)
Wenzheng Zhang (Tsinghua Univ.)
Xuewei Sun (Tsinghua Univ.)
Xingli Zheng (Zhuchen Electronics Packaging Co.)
Yicheng Dong (Wuhan Wireless Components Co.)
YuqinGu (Tsinghua Univ.)
Yukun Chen (Institute of No.4, M.I.I., China)
Ye Lin (Institute of No.55, M.I.I., China)
Zhuoshen Shen (Beijing Sci. & Tech. Univ., China)
General Secretary
Jusheng Ma (Tsinghua Univ.)
Deputy General Secretary
Hong Lou (China Academy of Electronic & Information Technology)

Workshop and Exhibition Committee
Chairman

Conference Dates
Jan.22,2000 Deadline for
receipt of abstract
Mar.22,2001 Notice of
acceptance sent to authors
Apr.22,2001 Deadline for
receipt of camera-ready
manuscripts
Jun.22,2001 Last day for
early registration
Aug.22,2001 Conference registration

Paper Submission Cover Sheet
Paper Title:

Technical Areas:

Author to contact:(Please select one author to be notified about paper status)

Name:
(first name) (middle name) (last name)

Company/institution/Affiliation:
Address: Phone:
Fax:
E-mail:

(country) (zip code)

Fax this sheet to:
Prof. Jusheng, Ma School of Materials Science and Engineering, Tsinghua University, (Secretary office of ISEPT'2001), Beijing 100084, China
Fax: 86-10-62772724(O) 86-10-62785673(H)
Tel: 86-10-62772724(O) 86-10-62785673(H)
e-mail: temptm@mail.tsinghua.edu.cn(O)

Conference Location
The conference will be held at Beijing International Convention Center, P. R. China.
Hotel Accommodation
Hotel rooms will be provided for participants in Beijing Continental Grand Hotel, a four-star rated hotel.
It is possible for one person (or family) to rent a double room as request, but the rate will be doubled.

Notes:
The contact committee, international advisory committee and other committee members will be changed if he/she is willing to take an active part in this symposium. Big market produce big commerce opportunities. We welcome everyone who want to play a important role in researches and industry applications of electronic materials and IC packaging in China and around the world.